Chemically amplified resist composition and patterning process
一种化学增幅、抗蚀剂的技术,应用在光学、图纹面的照相制版工艺、用于光机械设备的光敏材料等方向,能够解决感光度降低等问题
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[0282] Examples of the invention are given below by way of illustration and not by way of limitation. The abbreviation "pbw" means parts by weight.
[0283] Quencher 1-22, amine compound 1, and carboxylic acid 1 used in the resist composition have the structures shown below. Quenchers 1-22 were prepared by neutralization of ammonium hydroxide or amine compounds providing the cations shown below with carboxylic acids bearing iodo or bromo aromatic rings providing the anions shown below.
[0284]
[0285]
Synthetic example
[0287] Synthesis of base polymers (polymers 1-3)
[0288] The base polymer was prepared by combining appropriate monomers, performing their copolymerization reaction in a tetrahydrofuran (THF) solvent, pouring the reaction solution into methanol to crystallize, repeatedly washing with hexane, separating and drying. For the resulting polymers denoted polymers 1-3, using 1 Composition was analyzed by H-NMR spectroscopy, and Mw and Mw / Mn were analyzed by GPC using THF solvent relative to polystyrene standards.
[0289]
Embodiment 1-27 and comparative example 1-7
[0291] Preparation of resist composition
[0292] A resist composition was prepared by dissolving each component in a solvent according to the formulation described in Tables 1-3, and filtering through a filter having a pore size of 0.2 μm. The solvent contained 100 ppm of surfactant FC-4430 (3M). The components in Tables 1-3 are shown below.
[0293] Base polymer: Polymer 1-3 of the above formula
[0294] Organic solvents:
[0295] PGMEA (Propylene Glycol Monomethyl Ether Acetate)
[0296] CyH(cyclohexanone)
[0297] PGME (Propylene Glycol Monomethyl Ether)
[0298] Acid generator: PAG 1 to PAG 4 of the following structural formula
[0299]
[0300] Comparing Quenchers 1-5:
[0301]
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