High-thermal-conductivity silicon nitride ceramic material for 3D printing, and product thereof

A technology of silicon nitride ceramics and silicon nitride ceramic powder, which is applied in the field of 3D printing, can solve the problems of poor product quality stability, small elongation at break, and low dimensional accuracy, and achieve improved quality stability and elongation at break Moderate, excellent thermal conductivity effect

Inactive Publication Date: 2020-02-21
嘉兴饶稷科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] 1. The products obtained by 3D printing process have small thermal conductivity and poor thermal conductivity; low tensile strength, small elongation at break, and poor comprehensive properties such as mechanical properties;
[0011] 2. The molding speed is limited, and the dimensional accuracy is low when molding products with complex shapes;
[0012] 3. The quality of the products obtained by the 3D printing process is relatively poor, and defective products are prone to appear

Method used

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  • High-thermal-conductivity silicon nitride ceramic material for 3D printing, and product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] A 3D printing high thermal conductivity silicon nitride ceramic material is made of raw materials including the following parts by weight:

[0056] 100-120 parts of silicon nitride ceramic powder,

[0057] Silicon carbide fiber 17-22 parts,

[0058] 35-44 parts of ethoxylated trimethylolpropane triacrylate,

[0059] 24-30 parts of aliphatic polyurethane diacrylate,

[0060] 9-12 parts of tetrakis (3-mercaptopropionic acid) pentaerythritol ester,

[0061] 0.18-0.24 parts of photoinitiator,

[0062] Inhibitor 0.020~0.025 parts,

[0063] 4-6 parts of dispersant,

[0064] 3.5 to 4.5 parts of defoamer.

[0065] Preferably, the 3D printing high thermal conductivity silicon nitride ceramic material is made of raw materials including the following parts by weight:

[0066] Silicon nitride ceramic powder 110 parts,

[0067] Silicon carbide fiber 19.5 parts,

[0068] 39.5 parts of ethoxylated trimethylolpropane triacrylate,

[0069] 27 parts of aliphatic polyurethane di...

Embodiment 2

[0083] A 3D printing high thermal conductivity silicon nitride ceramic material is made of raw materials including the following parts by weight:

[0084] Silicon nitride ceramic powder 100 parts,

[0085] Silicon carbide fiber 17 parts,

[0086] 35 parts of ethoxylated trimethylolpropane triacrylate,

[0087] Aliphatic polyurethane diacrylate 24 parts,

[0088] 9 parts of tetrakis (3-mercaptopropionic acid) pentaerythritol ester,

[0089] 0.18 parts of photoinitiator,

[0090] 0.020 parts of polymerization inhibitor,

[0091] 4 parts of dispersant,

[0092] 3.5 parts of defoamer.

[0093] In this embodiment, the particle size of the silicon nitride ceramic powder is 0.4-0.6 μm.

[0094] In this embodiment, the photoinitiator is Irgacure784 from BASF Chemicals Co., Ltd.

[0095] In this embodiment, the polymerization inhibitor is pyrogallol.

[0096] In this embodiment, the dispersant is a mixture of ammonium polyacrylate and oleic acid.

[0097] In this embodiment, ...

Embodiment 3

[0101] A 3D printing high thermal conductivity silicon nitride ceramic material is made of raw materials including the following parts by weight:

[0102] 120 parts of silicon nitride ceramic powder,

[0103] Silicon carbide fiber 22 parts,

[0104] 44 parts of ethoxylated trimethylolpropane triacrylate,

[0105] Aliphatic polyurethane diacrylate 30 parts,

[0106] 12 parts of tetrakis (3-mercaptopropionic acid) pentaerythritol ester,

[0107] 0.24 parts of photoinitiator,

[0108] 0.025 parts of polymerization inhibitor,

[0109] 6 parts of dispersant,

[0110] 4.5 parts of defoamer.

[0111] In this embodiment, the particle size of the silicon nitride ceramic powder is 0.4-0.6 μm.

[0112] In this embodiment, the photoinitiator is Irgacure784 from BASF Chemicals Co., Ltd.

[0113] In this embodiment, the polymerization inhibitor is pyrogallol.

[0114] In this embodiment, the dispersant is a mixture of ammonium polyacrylate and oleic acid.

[0115] In this embodime...

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Abstract

The invention discloses a high-thermal-conductivity silicon nitride ceramic material for 3D printing, wherein the high-thermal-conductivity silicon nitride ceramic material is prepared from the following raw materials by weight: 100-120 parts of silicon nitride ceramic powder, 17-22 parts of silicon carbide fibers, 35-44 parts of ethoxylated trimethylolpropane triacrylate, 24-30 parts of aliphaticpolyurethane diacrylate, 9-12 parts of tetra(3-mercaptopropionic acid)pentaerythritol ester, 0.18-0.24 part of a photoinitiator, 0.020-0.025 part of a polymerization inhibitor, 4-6 parts of a dispersing agent and 3.5-4.5 parts of a defoaming agent. According to the invention, the high-thermal-conductivity silicon nitride ceramic material is high in thermal conductivity, excellent in thermal conductivity, high in tensile strength, moderate elongation at break and good in mechanical property and other comprehensive properties.

Description

technical field [0001] The invention relates to the technical field of 3D printing, in particular to a 3D printing high thermal conductivity silicon nitride ceramic material and product. Background technique [0002] As one of the important development trends of ceramic 3D printing technology in the future, ceramic SLA (Stereo Lithography Appearance) 3D printing technology based on the principle of stereolithography has the advantages of high molding quality, large size range of prepared parts, and close to ideal density. [0003] SLA molding technology uses photosensitive resin as raw material, controls the laser through computer, and scans point by point on the surface of liquid photosensitive resin according to the layered section information of the air dimension CAD model of the part, and the thin layer of resin in the scanned area produces photopolymerization reaction And assimilation, forming l thin layers of parts. After the assimilation of the first layer is complet...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/584C04B35/80C04B35/632C04B35/634B33Y70/10B33Y80/00C04B35/622
CPCB33Y70/00B33Y80/00C04B35/584C04B35/622C04B35/632C04B35/63424C04B35/63448C04B35/63456C04B2235/5244C04B2235/96C04B2235/9607
Inventor 赵喆姜焱林
Owner 嘉兴饶稷科技有限公司
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