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Modified vitrified micro bubble thermal insulation composite board and preparation method thereof

A technology of thermal insulation composite board and vitrified microbeads, applied in the direction of manufacturing tools, supply devices, ceramic molding machines, etc., can solve the problems of difficulty in maintaining excellent strength and thermal conductivity at the same time, and achieve excellent thermal insulation effect, low water absorption, The effect of extremely high water absorption

Active Publication Date: 2020-02-07
湖南斯多孚节能科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the deficiencies of the existing technology, the present invention provides a modified vitrified microbead thermal insulation composite board, which aims to solve the disadvantages that the strength and thermal conductivity of the existing inorganic thermal insulation material boards are difficult to maintain at the same time.

Method used

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  • Modified vitrified micro bubble thermal insulation composite board and preparation method thereof

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Embodiment Construction

[0030] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the implementation of the present invention For example, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0032] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the figure). Relative positional relationship, movement conditions, etc., ...

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Abstract

The invention discloses a modified vitrified micro bubble thermal insulation composite board and a preparation method thereof. The composite board sequentially comprises a surface layer, a thermal insulation layer and a bottom layer from top to bottom, the surface layer, the thermal insulation layer and the bottom layer are manufactured through a mold pressing integrated forming process, the surface layer is composed of interface mortar, the thermal insulation layer is composed of a modified vitrified micro bubble composite material, and the bottom layer is composed of bottom mortar. The modified vitrified micro bubble thermal insulation composite board has the advantages that the thermal insulation layer is composed of the modified vitrified micro bubble composite material, so that not only is excellent thermal insulation performance provided, but also the strength is good; the composite board adopts a three-time material distribution and mould pressing integrated forming process, sothat the strength of the formed board body is improved, and the formed modified vitrified micro bubble heat preservation layer still has excellent heat preservation and heat insulation performance.

Description

technical field [0001] The invention belongs to the technical field of building materials, and in particular relates to a modified vitrified microbead thermal insulation composite board and a preparation method thereof. Background technique [0002] Common inorganic insulation boards on the market include rock wool boards, foamed glass boards, foamed cement boards, foamed ceramic boards, etc. Among them, rock wool boards have relatively good fire resistance, heat preservation and sound absorption properties, and are light in weight, but their existence Easy to absorb water, low strength and other problems, it needs to be combined with silicon-calcium board and other boards to be better used; foamed glass board has disadvantages such as high brittleness, easy cracking, and high cost; foamed cement board has high thermal conductivity, thermal insulation, etc. Poor thermal performance, brittle and easy to crack, etc.; foamed ceramic plates have problems such as high thermal con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B28/04B28B3/00B28B13/02B28B11/24C04B111/28
CPCB28B3/00B28B11/245B28B13/02C04B28/04C04B2111/00612C04B2111/28C04B2201/32C04B14/06C04B24/2623C04B24/32C04B14/24C04B16/0666C04B2103/65C04B24/383C04B2103/0057
Inventor 陈新
Owner 湖南斯多孚节能科技有限公司
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