Millimeter wave frequency band amplifier chip packaging structure and manufacturing method thereof

Abstract

The invention provides a millimeter wave frequency band amplifier chip packaging structure and a manufacturing method thereof and relates to the technical field of chip packaging. The structure comprises a chip, a packaging substrate and a sealing cover, wherein the packaging substrate is provided with a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer and a third metal layer which are sequentially stacked from top to bottom, the sealing cover is arranged on the packaging substrate and used for sealing the packaging substrate, and the sealing cover is provided with an inner cavity with a downward opening. The millimeter wave frequency band amplifier chip packaging structure is advantaged in that the packaging substrate and the sealing cover are combined, an accommodating groove is formed in the packaging substrate so that the chip is accommodated, the connection length between the chip and the packaging substrate is effectively shortened, theparasitic inductance is conveniently reduced, and the transmission capability of the chip is improved; the sealing cover with the inner cavity enables connection between a chip direct-current port ofthe chip and the packaging substrate to be in direct contact with air, so loss of a high-frequency band is reduced, and radio frequency performance of the chip is improved.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, and more specifically relates to a millimeter-wave frequency band amplifier chip packaging structure and a method for manufacturing the packaging structure. Background technique [0002] With the development of millimeter wave frequency band technology, millimeter wave communication technology is widely used in mobile communication, radar detection, electronic countermeasures, precision guidance and other fields. Amplifier chips in the millimeter wave band generally adopt the design of monolithic microwave integrated circuits, which have the advantages of good microwave performance and high integration. [0003] At present, most microwave radio frequency chips use plastic encapsulation technology. In this process, the metal package carrier frame is firstly made, and then the chip is bonded on the frame, the chip is bonded to the package pin, the chip injection is completed through the inj...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a millimeter-wave frequency band amplifier chip package structure and a method for making the package structure, so as to solve the technical problem that the plastic package structure in the prior art is likely to cause excessive loss of the millimeter-wave amplifier and make it difficult to exert its superior performance

Images