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5G high-frequency high-speed hot press

A hot-press, high-frequency technology, used in presses, laminations, lamination devices, etc., can solve problems such as poor stability, inability to achieve self-locking, and inability to achieve pressure stability, to ensure product quality, parallelism and stability. The effect of pressure stabilization

Inactive Publication Date: 2020-01-10
四川豪威尔信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a 5G high-frequency high-speed hot press, which solves the problem of the low bearing capacity of the ball screw structure in the patent with the publication number CN208607536U, and cannot achieve self-locking and stable pressure. The role of the ball screw, and several ball screws must keep rotating at a constant speed, which requires extremely high precision coordination of the transmission mechanism. Once a problem occurs in one of the several ball screws, the equipment will not be able to operate normally, and the problem of poor stability

Method used

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] see Figure 1-6, the present invention provides a technical solution: a 5G high-frequency high-speed hot press, including a bottom box 1, the top of the bottom box 1 is fixedly connected with a top frame 2, and both sides of the bottom of the bottom box 1 are provided with casters 25, and the casters 25 is a universal wheel, and is provided with a locking pedal, cooperates with the leveling foot 27 to facilitate the movement and fixing of the equipment,...

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Abstract

The invention relates to the technical field of hot presses, and discloses a 5G high-frequency high-speed hot press which comprises a bottom box. A top frame is fixedly connected to the top of the bottom box, four guide shafts are fixedly arranged between the bottom of the top frame and the top of the bottom box in a connected mode, linear bearings are movably connected to the surfaces of the fourguide shafts, a movable pressing plate is arranged among the four guide shafts, and extension parts are arranged on the front surfaces and the back surfaces of two sides of the movable pressing plate. According to the 5G high-frequency high-speed hot press, the guide shafts are fixedly arranged between the bottom of the top frame and the top of the bottom box in the connected mode, the linear bearings and the guide shafts are matched to realize the guide of the movable pressing plate, the intelligent pressure control is realized, the parallelism and the pressure stability of the movable pressing plate mechanism after long-time operation are realized, the product quality is guaranteed, the linear bearings are easier to install and implement compared with a ball screw structure, the guide shafts are less prone to blocking caused by foreign matters compared with a screw rod, and operation is more stable and reliable.

Description

technical field [0001] The invention relates to the technical field of hot presses, in particular to a 5G high-frequency and high-speed hot press. Background technique [0002] The full name of copper clad laminate is copper clad laminate, which is the basic material for making printed circuit boards. The copper clad laminate industry has a history of nearly a hundred years. It is an inseparable history of technological development with the electronic information industry, especially the simultaneous development with the PCB industry. When the copper clad laminate is used in a multilayer PCB, it is also called a core board, which is responsible for the three functions of PCB board conduction, insulation and support. The performance of the copper clad laminate has a great influence on the performance, quality, processability and manufacturing cost of the PCB board. , is the foundation of the electronics industry. In simple terms, the process of copper clad laminates is to soa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B30B15/16B30B15/22B30B15/26B30B15/34B30B15/00B32B37/10
CPCB30B15/0052B30B15/166B30B15/22B30B15/26B30B15/34B32B37/10
Inventor 向彦瑾
Owner 四川豪威尔信息科技有限公司
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