A kind of packaging method of miniled backlight substrate

Abstract

A method for encapsulating a miniled backlight substrate, comprising the following steps: a material preparation step: preparing a double-sided copper-clad laminate, the thickness of the double-sided copper-clad laminate is 100-1000 μm, wherein the thickness of a single-layer copper foil is 12-35 μm; the drilling step: Drilling the double-sided copper-clad laminate to ensure that the drilled hole runs through the two layers of copper foil of the double-sided copper-clad laminate; copper plating step: copper-plating the drilled hole wall of the double-sided copper-clad laminate, Connect the copper foil on both sides of the double-sided copper-clad board to the copper-plated layer located on the wall of the drilled hole, so that the copper foils on both sides of the double-sided copper-clad board form an electrical connection; the hole filling step: use white resin or white Ink fills the drill hole. The white resin used in the anisotropic conductive adhesive manufacturing step melts and wraps the side of the miniled chip due to surface tension, thereby wrapping the chip independently to form a reflective cup, which improves the light intensity. reflective brightness.

Description

technical field [0001] The invention relates to a miniled backlight substrate packaging method. Background technique [0002] The specifications of flip chips are getting smaller and smaller, and the gap between positive and negative electrodes is as small as 20 μm. At present, the minimum gap of ordinary silver paste or tin paste can only realize the placement with a gap of 50 μm between the positive and negative electrodes, and it is very difficult, which may easily cause a micro-short circuit between the positive and negative electrodes. [0003] The number of Miniled backlight substrate chips is huge. For the traditional silver paste and solder paste process, during production, due to the long time of solid crystal, the solvent of the paste is easy to volatilize, resulting in the failure of placement. [0004] In addition, the brightness loss of the backlight substrate in the prior art is large, and there is a problem of light diffraction, which cannot block light and a...

AI Technical Summary

Problems solved by technology

At present, the minimum gap of ordinary silver paste or tin paste can only achieve the placement with a positive and negative gap of 50 μm, and it is very difficult, which may easily cause a micro-short circuit between the positive and negative electrodes

[0003] The number of Miniled backlight substrate chips is huge. For the traditional silver paste and solder paste process, during production, due to the long time of solid crystal, the solvent of the paste is easy to volatilize, resulting in the failure of placement

[0004] In addition, the brightness loss of the backlight substrate in the prior art is very large, and there is a problem of light diffraction, which cannot block light, which affects the visual experience

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