Three-dimensional imaging system based on TOF

A technology of three-dimensional imaging and laser emission module, which is applied in the field of TOF-based three-dimensional imaging system, can solve problems such as complex calculation, complex structure design, complex circuit design and compensation process, and achieve high measurement accuracy, high frame rate, and ensure measurement The effect of precision

Pending Publication Date: 2019-12-24
CHINA HEFEI TAIHE OPTOELECTRONICS TECH
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AI Technical Summary

Problems solved by technology

This scheme can obtain higher resolution and measurement accuracy, but the measurement distance is shorter and it is greatly affected by ambient light
Existing TOF-based 3D image imaging methods have complicated circuit design and compensation process, complex calculations, difficulty in obtaining a high frame rate, and are easily affected by background light
Based on mechanical scanning laser radar, the structural design is very complicated

Method used

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  • Three-dimensional imaging system based on TOF
  • Three-dimensional imaging system based on TOF
  • Three-dimensional imaging system based on TOF

Examples

Experimental program
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Embodiment Construction

[0050] A TOF-based three-dimensional imaging system, including a laser emitting module, a photosensitive sensor, an ARM processor module, an FPGA processing module, a memory module, a gigabit network port, a display module and a temperature sensor;

[0051] Among them, the laser emission module, memory module, FPGA processor module, and Gigabit Ethernet port are respectively connected to the ARM processor module; the Gigabit Ethernet port is connected to the display module, the laser emission module is connected to the temperature sensor, and the photosensitive sensor is connected to the FPGA processing module ;

[0052] The ARM processor module controls the laser emitting module to emit an optical signal. The optical signal is a narrow-band laser of 940nm. The optical signal is modulated by a 12MHZ sinusoidal signal to obtain a modulated optical signal. Increase the divergence angle of the laser; the laser emitting module transmits the modulated light signal to the target, an...

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Abstract

The invention discloses a three-dimensional imaging system based on TOF. The three-dimensional imaging system comprises a laser emitting module, a photosensitive sensor, an ARM processor module, an FPGA processing module, a memory module, a gigabit network port, a display module and a temperature sensor. According to the three-dimensional imaging system, an infrared light beam is emitted by emitting an active light source, a light signal is reflected back when encountering an obstacle along the propagation direction and is received through a lens, the influence of ambient light is filtered, and the photosensitive sensor is used for sensing the position and the distance of a target by receiving the amount of returned light. According to the three-dimensional imaging system, three-dimensional imaging of the target within ten meters can be realized, and high measurement precision can be realized; moreover, the system has a far measurement range, can adapt to the influence of certain ambient light while ensuring the measurement precision, and can obtain high frame rate; and the system is simple, effective and easy to use.

Description

technical field [0001] The invention belongs to the field of three-dimensional imaging and laser radar, relates to three-dimensional imaging technology, in particular to a TOF-based three-dimensional imaging system. Background technique [0002] Three-dimensional images can not only obtain plane image information but also obtain depth information, and have a wide range of application scenarios. Commonly used 3D image imaging methods include binocular and structured light solutions. This scheme can obtain higher resolution and measurement accuracy, but the measurement distance is relatively short, and it is greatly affected by ambient light. Existing TOF-based 3D image imaging methods have complicated circuit design and compensation process, complex calculations, difficulty in obtaining a high frame rate, and are easily affected by background light. Based on mechanical scanning laser radar, the structural design is very complicated. [0003] In order to solve the above dra...

Claims

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Application Information

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IPC IPC(8): G01S17/89G01S17/06G01S17/08G01S7/495
CPCG01S17/89G01S17/06G01S17/08G01S7/495Y02A90/10
Inventor 万云武贾仁耀石江涛陈晓东黄守强叶松
Owner CHINA HEFEI TAIHE OPTOELECTRONICS TECH
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