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A new type of adhesive and thermal interface material

A technology of adhesives and thermally conductive fillers, applied in the direction of adhesive types, polyurea/polyurethane adhesives, non-polymer adhesive additives, etc., can solve the problem that the thermal conductivity of thermally conductive fillers cannot meet the heat dissipation requirements of electronic products. And other issues

Active Publication Date: 2021-09-14
SHANGHAI ALLIED PLASTIC IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity filler used in this invention can improve the thermal conductivity far from meeting the heat dissipation requirements of electronic products.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0019] As a preferred embodiment, the new adhesive, in parts by weight, its preparation raw materials include: 5 parts of polyester polyol, 14 parts of isocyanate, 2 parts of chain extender, 0.5 parts of catalyst, 50 parts of thermally conductive filler , 23 parts of carbon materials.

[0020] As a preferred embodiment, the novel adhesive further includes 0.5-3 parts of polymeric siloxane in parts by weight.

[0021] Preferably, the new adhesive also includes 2 parts by weight of polymeric siloxane.

[0022] Polyester polyol

[0023] In the present application, the polyester polyol refers to the condensation of organic dicarboxylic acid (anhydride or ester) and polyol or the polymerization of lactone and polyol. Among them, the organic dicarboxylic acid may include: phthalic acid, phthalic anhydride or its ester, adipic acid, halogenated phthalic acid, and the like. Examples of the polyhydric alcohol include ethylene glycol, propylene glycol, diethylene glycol, trimethylol...

Embodiment 1

[0085] A new type of adhesive, in parts by weight, its preparation raw materials include: 5 parts of polyester polyol, 14 parts of isocyanate, 2 parts of chain extender, 0.5 parts of catalyst, 50 parts of thermally conductive filler, 23 parts of carbon material, polymerization type Silicone 2 parts.

[0086] Described polyester polyol is the mixture of phthalic anhydride polyester polyol and polybutylene adipate polyol; The weight of described phthalic anhydride polyester polyol and polybutylene adipate polyol The ratio is 2:1; the model of the phthalic anhydride polyester polyol is HF-8011, purchased from Zhejiang Huafeng New Materials Co., Ltd.; the model of the polyethylene adipate butylene glycol ester polyol is PE-1320 , purchased from Zhejiang Huafon New Materials Co., Ltd.

[0087] The isocyanate is xylene diisocyanate.

[0088] The chain extender is a mixture of 1,4-butanediol and 1,6-hexanediol; the weight ratio of the 1,4-butanediol to 1,6-hexanediol is 3:1.

[00...

Embodiment 2

[0098] A new type of adhesive, in parts by weight, its preparation raw materials include: 3 parts of polyester polyol, 10 parts of isocyanate, 1 part of chain extender, 0.1 part of catalyst, 47 parts of thermal conductive filler, 20 parts of carbon material, polymerization type 0.5 parts of siloxane.

[0099] Described polyester polyol is the mixture of phthalic anhydride polyester polyol and polybutylene adipate polyol; The weight of described phthalic anhydride polyester polyol and polybutylene adipate polyol The ratio is 1:1; the model of the phthalic anhydride polyester polyol is HF-8011, purchased from Zhejiang Huafon New Materials Co., Ltd.; the model of the polyethylene adipate butylene glycol ester polyol is PE-1320 , purchased from Zhejiang Huafon New Materials Co., Ltd.

[0100] The isocyanate is xylene diisocyanate.

[0101] The chain extender is a mixture of 1,4-butanediol and 1,6-hexanediol; the weight ratio of 1,4-butanediol and 1,6-hexanediol is 2:1.

[0102]...

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Abstract

The invention belongs to the technical field of heat-conducting materials, and in particular relates to a novel adhesive and a heat-conducting interface material. The invention discloses a new type of adhesive. In parts by weight, its preparation raw materials include: 3-8 parts of polyester polyol, 10-16 parts of isocyanate, 1-4 parts of chain extender, 0.1-2 parts of catalyst, 47-58 parts of thermal conductive filler, 20-25 parts of carbon material.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting materials, and in particular relates to a novel adhesive and a heat-conducting interface material. Background technique [0002] With the rapid development of science and technology, polymer materials are more used in heavy machinery, high-power electrical appliances and electronic products. Products used in these fields often bear a lot of heat. If the generated heat cannot be exported in time, allowing the polymer to bear the heat will reduce the performance of the polymer material, shorten its service life, and even cause fire and other safety hazards. ACCIDENT. [0003] Due to the advantages of polyurethane materials in many aspects in structure and performance, the research and development of thermally conductive polyurethane materials has become one of the research hotspots in the field of polymer materials. CN105237723 disperses graphene oxide in polyurethane prepolymer to prepare...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/06C09J175/04C09J11/04C08G18/76C08G18/66C08G18/61C08G18/42C08G18/32
CPCC08G18/3206C08G18/4202C08G18/4208C08G18/4238C08G18/61C08G18/664C08G18/7671C08K2003/0812C08K2003/282C08K2201/014C09J11/04C09J175/04C09J175/06C08K7/06C08K3/28C08K3/08
Inventor 范勇程亚东张玲华
Owner SHANGHAI ALLIED PLASTIC IND
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