High-performance computer CPU radiator

Abstract

The invention discloses a high-performance computer CPU radiator. The radiator comprises a CPU heat-conducting fin, a heat-conducting strip, a cooling fin, a fan shell, a fan motor and a fan impeller.The CPU heat-conducting fin is detachably fixed on the upper surface of the CPU. One end of the heat conduction strip is fixed on the upper end surface of the CPU heat conduction sheet, and the otherend of the heat conduction strip is detachably connected with the heat dissipation sheet. The heat dissipation sheet is positioned at an air outlet of the fan shell, the fan motor is arranged in thefan shell, and the fan impeller is fixedly arranged on a rotating shaft of the fan motor. Compared with the prior art, heat dissipation is conducted through the heat conduction structure and the thinturbine type draught fan, the heat dissipation efficiency is high, the thickness is small, the thickness of the notebook computer is not affected, the thickness can be kept small, the heat dissipationefficiency is guaranteed, and the application and popularization value is achieved.

Description

technical field [0001] The invention relates to computer hardware, in particular to a high-performance computer CPU radiator. Background technique [0002] When the CPU is working, it will generate a lot of heat. If the heat is not dissipated in time, it will cause a crash, or burn the CPU. The CPU radiator is used to dissipate heat for the CPU. The heat sink plays a decisive role in the stable operation of the CPU. In the prior art, the heat dissipation performance of the thin notebook computer is poor, which leads to insufficient heat dissipation of the notebook computer. If a conventional large-volume heat sink is used, the heat dissipation may be The effect is good, but it will increase the volume of the notebook computer, making the notebook computer inconvenient to carry. Therefore, it is necessary to improve the heat dissipation efficiency while maintaining a thin profile. Contents of the invention [0003] The object of the present invention is just to provide a k...

AI Technical Summary

Problems solved by technology

The heat sink plays a decisive role in the stable operation of the CPU. In the prior art, the heat dissipation performance of the thin notebook computer is poor, which leads to insufficient heat dissipation of the notebook computer. If a conventional large-volume heat sink is used, the heat dissipation may be The effect is good, but it will increase the volume of the laptop, making the laptop not easy to carry. Therefore, it is necessary to improve the heat dissipation efficiency while maintaining a thin shape

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