Adhesion process for thin PLC wafer and cover plate

Abstract

The invention provides an adhesion process for a thin PLC wafer and a cover plate. The adhesion process comprises the steps that S1 the wafer is placed on the base of an adhesive jig; S2 UV glue including cyanoacrylate molecules is dispensed in the middle of the wafer through a syringe; S3 a quartz glass cover with a thickness of 1mm gently covers the wafer after step S2; S4 the upper cover of theadhesive jig presses the wafer after step S3, and the upper cover needs to be aligned with a positioning hole in the adhesive jig, and fixing bolts around the adhesive jig are tightened tightly; S5 standing and waiting for 15min are carried out; S6 after 15min, whether the glue under the cover spreads to the edge of the wafer and overflows is observed; S7 the upper cover is removed, and the waferis removed; and S8 the wafer is put into an exposure box and fully exposed for 15min, and the UV glue is cured. According to the invention, defective products can be effectively reduced; the production efficiency is improved; abnormal wear of a blade and the wafer can be reduced; and the amount of production consumables is reduced.

Description

technical field [0001] The invention mainly relates to the field of semiconductors, in particular to a thin PLC wafer and cover board bonding process. Background technique [0002] Since the bonding strength of the old type of UV glue is not high after curing, the cover plate of the conventional PLC wafer is quartz glass with a thickness of 1.5mm. Since the overall thickness of the wafer has reached more than 2.5mm, when cutting the wafer with a grinding wheel cutting machine, the grinding wheel blade is subjected to great resistance, which is likely to cause the edge of the workpiece (chip) to collapse, and in severe cases, it will damage the waveguide. Due to the high friction force on the blade, the blade generates a lot of heat during cutting, which reduces the strength of the blade. When the position of the cooling water nozzle is deviated, the strength of the blade decreases sharply and the blade breaks. During the process of detaching from the wafer, it is easy to ca...

AI Technical Summary

Problems solved by technology

Since the overall thickness of the wafer has reached more than 2.5mm, when cutting the wafer with a grinding wheel cutting machine, the resistance of the grinding wheel blade is very large, and it is easy to cause the edge of the workpiece (chip) to collapse, and in severe cases, it will damage the waveguide.

Due to the high friction force on the blade, the blade generates a lot of heat during the cutting process, which reduces the strength of the blade. When the position of the cooling water nozzle is deviated, the strength of the blade decreases sharply and the blade breaks. During the process of detaching from the wafer, it is easy to cause problems such as cutting line deviation and wafer damage

These problems have existed in the industry for a long time, seriously affecting production efficiency and production costs