Thermal shock test device and method for nanometer-scale wire material

A test device and test method technology, applied in the direction of measurement device, material thermal analysis, material analysis, etc., to avoid friction damage, good protection, and low test cost.

Pending Publication Date: 2019-11-15
CHINA ACADEMY OF SPACE TECHNOLOGY
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  • Abstract
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Problems solved by technology

[0005] The technical problem solved by the patent of this invention is: a new type of thermal shock test device is adopted to solve the problem of rapid temperature transfer, faster temperature balance and protection of filaments under the condition of large temperature change. The problem of not being damaged during the impact

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  • Thermal shock test device and method for nanometer-scale wire material
  • Thermal shock test device and method for nanometer-scale wire material
  • Thermal shock test device and method for nanometer-scale wire material

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Embodiment Construction

[0035] The thermal shock test device in the patent of the present invention includes a complete set of sample fixing, heating, cooling, temperature control and transfer devices, which is suitable for thermal shock tests of extremely fine wires with diameters of nanometer scale. The thermal shock test device involved in the patent of the present invention has a wide test temperature range, covering the liquid nitrogen temperature (-196°C) and the spacecraft service temperature range of -180°C to 300°C. For the nano-micron scale wire samples, the fixed tooling protected by the helical metal wire sleeve is used for loading, and a certain distance is kept between the wires in a relaxed state to avoid material collision, friction and damage. This method can be used for thermal shock test The materials include, but are not limited to, nanometer-scale filamentary metals, non-metals, composite materials, and coated materials.

[0036] The device of the present invention is composed of...

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Abstract

The present invention discloses a high-low temperature thermal shock test method for a wire material, in particular, a thermal shock test device and method for a nanometer-scale wire material. As an important composition part of a structure and a functional product of a spacecraft, the nanometer-scale wire material needs to have an ability to adapt to a condition of a large temperature difference.However, in the existing thermal shock test device, a surface of a wire material is extremely vulnerable to damage, and therefore determining of changes of material properties is affected. The present invention provides a thermal shock test device and method for a nanometer-scale wire material, and the device includes five parts: a wire material fixing tool, a heating device, a refrigeration device, a temperature control system, and a transfer mechanism. A problem that the wire material is susceptible to collision, friction and damage during a thermal shock test is solved, so that temperaturetransfer under a condition of a large temperature difference can be quickly performed and temperature balance can be quickly implemented, and the test device is more expandable, so that efficiency and reliability of the test are improved.

Description

technical field [0001] The invention relates to a high and low temperature thermal shock test method for wire materials, in particular to a thermal shock test device and method for wire materials with diameters of nanometer scale, belonging to the technical field of material detection. Background technique [0002] In various military and civilian satellites and other aerospace and aerospace vehicles, nanometer-scale wires are used more and more widely as components of structural and functional products, such as gold-plated wires for deployable antenna reflector metal mesh braided structures Nano-micron filaments are used as the key materials for the braided structure of the electromagnetic wave shielding body, the alloy wire for the electrical contact friction pair of the solar panel, etc. The extravehicular materials of spacecraft are generally affected by the alternating high and low temperature environment in space during their in-orbit service, especially for low-earth ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/00
CPCG01N25/00
Inventor 孔静于翔天高鸿李岩王向轲何瑞鹏汪洋
Owner CHINA ACADEMY OF SPACE TECHNOLOGY
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