A method of mutual positioning and clamping of micro-nano ends based on 3D imaging feedback

Abstract

The invention belongs to the technical field of micro-nano technologies and micro-electromechanical integration, and particularly relates to a micro-nano tail end mutual positioning and clamping method based on three-dimensional imaging feedback. Based on the three-dimensional vision imaging technology, a micromachining device and the three-dimensional imaging feedback technology, multiple micro-nano tail ends are positioned and clamped at the target micro-nano tail end, the problem that an existing micro-nano tail end positioning and clamping structure is simplex is solved, the method has theadvantage of automatic operation, and the positioning precision of positioning and clamping the micro-nano tail ends is improved; in addition, the bending position and the bending angle of the multiple micro-nano tail ends are controlled, so that the tip ends of the multiple micro-nano tail ends and the tip end of the target micro-nano tail end are positioned on the same straight line or the sameplane, cooperative execution of the multiple micro-nano tail ends is facilitated, and working efficiency is improved.

Description

technical field [0001] The invention belongs to the technical fields of micro-nano technology and micro-electromechanical integration, and in particular relates to a method for mutual positioning and clamping of micro-nano ends based on three-dimensional imaging feedback. Background technique [0002] At present, the micro-nano tip is a common actuator tool in the field of micro-nano research. The simple structure design has obvious economic and practical benefits for applications such as micro-nano operation and measurement. However, for some special occasions, the collaborative execution of multiple micro-nano ends is required, which requires a variety of structural forms of the micro-nano ends. Although the traditional manual micro-nano terminal design method is relatively simple, there are problems such as single structure and low efficiency. In addition, the positioning and clamping of the single micro-nano end is relatively simple. Due to the lack of open-loop control...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a micro-nano terminal mutual positioning and clamping method based on three-dimensional imaging feedback to solve the existing micro-nano terminal positioning and clamping problems of single structure, low efficiency, low positioning and clamping accuracy and poor effect , at the same time, realize the function of mutual positioning and clamping of multi-micro-nano ends, with the advantages of three-dimensional real-time imaging and feedback, and automatic operation

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