System-in-package thermal reliability comprehensive optimization design method
A system-in-package, optimized design technology, used in computing, special data processing applications, instruments, etc., to solve problems such as cracks, less reliability of micro-bumps, and reliability of warped micro-bumps
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[0026] The comprehensive optimization design method of the system-in-package thermal reliability of the present invention will be described in detail below with reference to the accompanying drawings and embodiments.
[0027] It is realized through the following technical solutions: establishing a system-level package structure model, including a substrate 1, a redistribution layer 3, micro bumps 2, a bare chip 5 and an epoxy molding material 4.
[0028] Screen the relevant factors A, B, C, D, E that affect structural warpage, and consider the actual process to determine the level of factors. Among them, A represents the thickness of the substrate 1, B represents the thickness of the overmolding layer 6, C represents the thickness of the redistribution layer 3, D represents the thickness of the epoxy molding material 4, and E represents the thickness of the 5 layers of the bare chip; The curve is the response condition, and the test is simulated by using finite element analysi...
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