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Packaging process of contact identity card and contact identity card

A technology of identification card and packaging process, applied in the field of contact identification card, can solve the problems of high cost, thick product thickness, complex packaging process, etc., to reduce product thickness, simplify the production process, and simplify the production process. Effect

Pending Publication Date: 2019-11-08
惠州市志金电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies in the prior art, one of the purposes of the present invention is to disclose a packaging process for a contact-type identification card, which is used to solve the problems of complicated packaging process, high cost and thick product thickness of the existing contact-type identification card. question

Method used

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  • Packaging process of contact identity card and contact identity card
  • Packaging process of contact identity card and contact identity card
  • Packaging process of contact identity card and contact identity card

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Embodiment Construction

[0029] Below, the present invention will be further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of not conflicting, the various embodiments described below or the technical features can be combined arbitrarily to form new embodiments. .

[0030] Such as Figure 1-2 As shown, the embodiment of the present invention provides a packaging process S100 of a contact identification card 10, including the following steps:

[0031] Step S10, providing a conductive substrate 1, and preparing a photosensitive film 2 on the front and back sides of the conductive substrate 1, respectively;

[0032] Step S20, respectively exposing and developing the photosensitive film 2 on the front and back sides of the conductive substrate 1, so as to form a circuit pattern structure 3 on the front and back sides of the conductive substrate 1, respectively;

[0033] Step S30, performing resist treatment on the c...

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Abstract

The invention discloses a packaging process of a contact identity card and a contact identity card. The packaging process of the contact identity card comprises the following steps of: providing a conductive substrate, and separately preparing photosensitive films on the front and back surfaces of the conductive substrate; exposing and developing the photosensitive films to form a line pattern structure; forming a resist layer in the region of the line pattern structure; removing the photosensitive films; etching a region on the conductive substrate that does not have the resist layer, forminga plurality of bearing surfaces and a plurality of front electrodes on the front surface of the conductive substrate, and forming a back electrode on the back surface of the conductive substrate to obtain a packaging substrate; implanting a chip into the packaging substrate and performing a plastic packaging process to obtain a chip packaging structure; cutting the chip packaging structure to obtain the contact identity card. The manufacturing process uses the conductive substrate as a base material, reduces the production cost and the product thickness, avoids steps of drilling, electroplating copper, solder resist printing and the like compared with a conventional process, and is simpler.

Description

technical field [0001] The invention relates to the field of packaging of contact-type identification cards, in particular to a packaging process for a contact-type identification card and a contact-type identification card produced by the packaging process. Background technique [0002] With the development of wireless technology, contact identification cards (contact SIM cards) such as mobile phone communication cards, bank cards, and social security cards are widely used. With the vast market of the Internet of Things, the market demand for SIM cards has further increased. In the prior art, during the packaging process of the SIM card, the insulating material covered with copper on both sides is generally used as the base material. During the packaging process, a series of cumbersome processes such as drilling holes on the base material and copper plating are required. The packaging process is complicated, the production efficiency is low, the cost is high, and the produ...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L21/60H01L23/498H01L23/49H01L21/56H01L23/31
CPCH01L23/49855H01L23/49838H01L23/49811H01L24/43H01L24/45H01L21/4853H01L23/3121H01L21/56H01L2224/43H01L2224/4502H01L2224/97H01L2224/48091H01L2924/181H01L2924/00014H01L2924/00012
Inventor 康孝恒蔡克林李瑞许凯
Owner 惠州市志金电子科技有限公司
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