Mask assembly and manufacturing method of Mini LED backlight module

Abstract

The invention discloses a mask assembly and a manufacturing method of a Mini LED backlight module. After luminous chips are subjected to crystal fixing, the mask assembly is pasted above the luminouschips, all mask regions correspond to the luminous chips one to one, thus, second shielding parts of the mask regions cover the luminous chips, spraying parts correspond to the positions of gaps in the peripheries of the luminous chips, then materials for manufacturing reflecting structures are sprayed to the positions of the gaps of the luminous chips through hollowed-out regions of the sprayingparts to form the reflecting structures, as the materials for manufacturing the reflecting structures can be simultaneously sprayed to the peripheries of the luminous chips, the procedures are simple,the consumed time is short, the spraying efficiency is high, and mass production is achieved; and in the spraying process, the second shielding parts shield the luminous chips, the spraying materialsare prevented from being sprayed onto the luminous chips, and therefore no large welding error is caused to the following Mini LED backlight module.

Description

Technical field [0001] The present invention relates to the field of display technology, in particular to a manufacturing method of a mask assembly and a Mini LED backlight module. Background technique [0002] Existing research has found that if white silica gel with a reflectivity of up to 95% made of mixed titanium dioxide is coated on the gap between the light-emitting chips on the MiniLED backlight substrate to form a mouth wall, such as Figure 1A with Figure 1B As shown, Figure 1A It is a schematic diagram of the top structure of Mini LED backlight, Figure 1B for Figure 1A As shown in the schematic cross-sectional structure of the Mini LED backlight, the formation of a mouth-shaped wall 3 in the gap between the light-emitting chips 2 on the base substrate 1 can greatly improve the light efficiency of the light-emitting chip 2 and thus the overall brightness of the Mini LED backlight. Parameters such as the height h of the shaped wall 3 and the distance d from the light emi...

AI Technical Summary

Problems solved by technology

[0007] The embodiment of the present invention provides a method for manufacturing a mask assembly and a Mini LED backlight module, which is used to solve the complicated process in the silicone coating method for forming a mouth-shaped wall around the light-emitting chip in the existing Mini LED backlight. , low spraying efficiency, lack of mass production and other insurmountable shortcomings

Images