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Ultra-thin electrolytic copper foil and preparation method thereof

An electrolytic copper foil and ultra-thin technology, applied in the field of electrolytic copper foil, can solve problems such as difficulty in preparing ultra-thin copper foil, and achieve the effects of being beneficial to industrial large-scale production, good tensile strength and flatness, and simple process

Active Publication Date: 2019-11-01
HUBEI ZHONGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an ultra-thin electrolytic copper foil and its preparation method, which is used to solve the problem that the electrolytic copper foil process is difficult to prepare in the prior art and the ultra-thin copper foil below 6 μm

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  • Ultra-thin electrolytic copper foil and preparation method thereof

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[0016] see figure 1 , figure 1 It is a process flow chart of an embodiment of the method for preparing ultra-thin electrolytic copper foil in the present invention. The preparation method of ultra-thin electrolytic copper foil in the present invention, its steps comprise:

[0017] S1: Set the anode plate and the cathode roll, and immerse in the copper electrolyte. Specifically, the preferred materials and proportions of the anode plate, cathode roll and copper electrolyte in this step are described in detail respectively.

[0018] In this embodiment, the anode plate is an active coating plate, and the active coating plate includes an active coating and a substrate, wherein: the active coating includes noble metals such as palladium, iridium, ruthenium, cobalt, lead, manganese, etc., and the active coating The total amount of precious metal in the layer is not less than 2g / m 2 , and the density of iridium is 0.5~5g / m 2 , the purpose of setting the above-mentioned various p...

Embodiment 1

[0026] S1: choose to contain 2g / m 2 The active coating of iridium and the titanium plate form the anode plate, and the stainless steel roller plated with chrome on the surface is used as the cathode roller. Copper electrolyte is prepared by mixing copper sulfate, sulfuric acid and hydrochloric acid. The copper ion concentration in the copper electrolyte is 60g / L, sulfuric acid 100g / L, the chloride ion concentration is 25mg / L, and the anode plate and the cathode roll are immersed in the copper electrolyte.

[0027] S2: Take an appropriate amount of sodium polydithiodiphenyl sulfonate, sodium N,N-dimethyldithioformamide propane sulfonate, hydroxyethyl cellulose and collagen to make an additive, and the additive is polydithiodiphenyl The concentration of sodium sulfonate is 25 mg / L, the concentration of N,N-dimethyldithioformamide propane sulfonate is 30 mg / L, the concentration of hydroxyethyl cellulose is 25 mg / L, and the concentration of collagen is 120mg / L and a molecular we...

Embodiment 2

[0030] S1: choose to contain 2g / m 2 The active coating of iridium and the titanium plate form the anode plate, and the stainless steel roller plated with chrome on the surface is used as the cathode roller. Copper electrolyte is prepared by mixing copper sulfate, sulfuric acid and hydrochloric acid. The copper ion concentration in the copper electrolyte is 75g / L, sulfuric acid is 120g / L L, chloride ion concentration 35mg / L, immerse the anode plate and the cathode roll in the copper electrolyte.

[0031]S2: Take an appropriate amount of sodium polydithiodiphenyl sulfonate, sodium N,N-dimethyldithioformamide propane sulfonate, hydroxyethyl cellulose and collagen to make an additive, and the additive is polydithiodiphenyl The concentration of sodium sulfonate is 25 mg / L, the concentration of N,N-dimethyldithioformamide propane sulfonate is 45 mg / L, the concentration of hydroxyethyl cellulose is 35 mg / L, and the concentration of collagen is 150mg / L and a molecular weight of 2500,...

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Abstract

The invention discloses an ultra-thin electrolytic copper foil and a preparation method thereof. The method comprises the following steps that an anode plate and a cathode roller are arranged and aresoaked in a copper electrolyte; an additive is added into the copper electrolyte and uniformly mixed; a direct current is exerted between the anode plate and the cathode roller and electrolysis is performed to prepare the copper foil on the surface of the cathode roller; and the additive comprises sodium dodecyl benzene sulfonate, sodium 3-mercaptopropanesulphonateand hydroxyethyl cellulose and collagen, and the concentration of sodium dodecyl benzene sulfonate is 20-70 mg / L, the sodium 3-mercaptopropanesulphonateand hydroxyethyl cellulose with the concentration of 30 -60 mg / L, and the concentration of the hydroxyethyl cellulose is 20-50 mg / L, the concentration of the collagen is 100-180 mg / L, and the molecular weight of the copper foil is 2000-4000. According to the preparation method, through introducing the additive with a specific ratio, crystal grains can be further refined during direct current electrolysis, and the ultra-thin copper foil with the thickness of less than 6 micronscan be prepared while ensuring that the copper foil has good tensile strength and flatness; and the process is simple and convenient, and facilitates the industrial large-scale production.

Description

technical field [0001] The invention relates to the field of electrolytic copper foil, in particular to an ultra-thin electrolytic copper foil and a preparation method thereof. Background technique [0002] At present, the methods of preparing copper foil can be mainly divided into calendered copper foil and electrolytic copper foil. The calendered copper foil has a higher density and a smoother product surface, which is conducive to the rapid transmission of signals after being made into a printed circuit board. Therefore, it is often used in high High-frequency and high-speed transmission and fine circuit printed circuit boards, but because the cost of the rolled copper foil process is much higher than that of the electrolytic copper foil, and there are many restrictions on the process conditions, it is difficult to apply the rolled copper foil process to the wide-width copper foil. Large-scale preparation; electrolytic copper foil is a method of producing copper foil thro...

Claims

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Application Information

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IPC IPC(8): C25D1/04H01M4/38H01M4/134
CPCC25D1/04H01M4/134H01M4/38H01M2004/027Y02E60/10
Inventor 张干成曾潮彭硕
Owner HUBEI ZHONGYI TECH
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