Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Apparatus and method for vapor cell atomic frequency reference having improved frequency stability

A technology of vapor pool and chip-level atomic clock, which is applied in the direction of instruments using atomic clocks, stable output, electrical components, etc., and can solve problems such as low frequency reference accuracy

Active Publication Date: 2019-10-22
HONEYWELL INT INC
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

CSACs are cheaper and smaller than cold atom based clocks, but have less accurate frequency references

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Apparatus and method for vapor cell atomic frequency reference having improved frequency stability
  • Apparatus and method for vapor cell atomic frequency reference having improved frequency stability
  • Apparatus and method for vapor cell atomic frequency reference having improved frequency stability

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073]Embodiment 1 includes a chip-scale atomic clock (CSAC) comprising: a thermostabilized physical system including a vapor cell and a magnetic field coil enclosed in a magnetic shield; and a thermostabilized physical system electrically coupled to the thermostabilized physical system. stabilize electronic circuits.

[0074] The CSAC of Embodiment 1, further comprising a non-thermostable electronic circuit electrically coupled to at least one of the thermostable physical system and the thermostable electronic circuit.

[0075] The CSAC of embodiment 2, wherein the non-thermostatic electronic circuit includes at least one of a controller circuit and a power regulation circuit.

Embodiment 4

[0076] Embodiment 4 includes the CSAC of Embodiment 3, wherein the non-thermostatic electronic circuit further includes at least one of: a crystal oscillator, a phase locked loop, at least one heater current control circuit, and at least one coil current control circuit .

Embodiment 5

[0077] Embodiment 5 includes the CSAC of Embodiment 4, wherein the non-thermostatic electronic circuit further includes at least one of: at least one digital-to-analog converter and at least one heater.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an apparatus and method for a vapor cell atomic frequency reference having improved frequency stability. A chip scale atomic clock (CSAC) is provided. The CSAC comprises a temperature stabilized physics system, comprising a vapor cell and a magnetic field coil, and which is enclosed in a magnetic shield; and a temperature stabilized electronics circuitry electrically coupledto the temperature stabilized physics system.

Description

Background technique [0001] Chip-scale atomic clocks (CSACs) using atomic vapor cells provide up to four orders of magnitude higher accuracy than temperature-controlled oscillators (TCXOs) when used as frequency references. CSACs are cheaper and smaller than cold-atom-based clocks, but have less accurate frequency references. There is a need to improve the stability of the CSAC over temperature, thereby extending the time period required between synchronization with the main frequency reference. Contents of the invention [0002] A chip scale atomic clock (CSAC) is provided. The CSAC includes: a thermostatic physical system including a vapor cell and a magnetic field coil enclosed in a magnetic shield; and a thermostatic electronic circuit electrically coupled to the thermostatic physical system. Description of drawings [0003] It should be understood that the accompanying drawings illustrate only exemplary embodiments and are therefore not to be considered limiting in ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G04F5/14
CPCG04F5/14G04F5/145H03L7/26H03L1/04H01S5/02208H01S5/02469H01S5/183H03B17/00H01S5/02325
Inventor 杰弗里·詹姆斯·克里茨罗伯特·康普顿
Owner HONEYWELL INT INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com