Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A sensor and electronic device

A sensor and sensitive technology, applied in the field of measurement, can solve problems such as the difficulty of semiconductor manufacturing, and achieve the effect of ensuring performance, improving manufacturing accuracy, and avoiding alignment

Active Publication Date: 2021-12-31
WEIFANG GOERTEK MICROELECTRONICS CO LTD +1
View PDF14 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Sensors with this structure need to precisely control the position of the GMR and the magnet in the three-dimensional direction, which is very difficult for semiconductor manufacturing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A sensor and electronic device
  • A sensor and electronic device
  • A sensor and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0025] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0026] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0027] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a sensor and an electronic device, comprising a substrate and a sensitive film connected on the substrate, the sensitive film is suspended on the substrate and configured so that when an external force is applied, the sensitive film will move in a direction perpendicular to its film surface Deformation occurs; a magnetoresistance is also provided on the sensitive film; it also includes a fixed part connected to the substrate, and the fixed part is not sensitive to external force; the fixed part and the sensitive film are located in the same plane, and the position adjacent to the magnetoresistance is set on the fixed part There is a wire configured to pass an electric current to generate a magnetic field induced by the magnetoresistance. According to an embodiment of the present disclosure, the sensitive film and the fixing part are located in the same plane, which can avoid problems such as alignment during manufacture of the traditional sensor structure, thereby improving the manufacturing accuracy of the detection structure and ensuring the performance of the sensor.

Description

technical field [0001] The present invention relates to the field of measurement, more specifically, the present invention relates to a sensor, such as a microphone, a displacement sensor, etc.; the present invention also relates to an electronic device using the sensor. Background technique [0002] Existing sensors, such as microphones, displacement sensors, etc., are all detected by the principle of a flat capacitor. For example, in the structure of the microphone, the plate capacitor includes a substrate and a back plate and a diaphragm formed on the substrate. There is a gap between the back plate and the diaphragm, so that the back plate and the diaphragm form a flat plate The capacitor sensing structure. [0003] However, in view of the problems of acoustic resistance, back cavity, etc., and low detection sensitivity that cannot be solved by the capacitor sensing structure, magnetic sensors have gradually become a trend in the detection field. In the existing magnet...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01D5/16
CPCG01D5/16
Inventor 邹泉波丁凯文
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products