Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Grinding pad cleaning device and double-face grinding machine

A technology for cleaning devices and polishing pads, which is applied in the direction of grinding devices, grinding machine tools, cleaning methods and tools, and can solve the problems of unclean cleaning, deterioration of the surface of the polishing pad, flatness of wafer scratches, etc.

Inactive Publication Date: 2019-10-18
XIAN ESWIN SILICON WAFER TECH CO LTD
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a polishing pad cleaning device and a double-sided lapping machine to solve the problem that the surface of the polishing pad is not cleaned cleanly, which leads to scratches and flatness deterioration of the wafer during processing.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Grinding pad cleaning device and double-face grinding machine
  • Grinding pad cleaning device and double-face grinding machine
  • Grinding pad cleaning device and double-face grinding machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.

[0032] like figure 1 As shown, the grinding mechanism used to remove the damage on the wafer surface during the forming process includes an upper fixed plate 110 and a lower fixed plate 120, and the upper fixed plate 110 and the lower fixed plate 120 are driven by the internal gear 310 and the external gear 320. Reverse rotation movement; the lower surface of the upper fixed plate 110 is a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a grinding pad cleaning device and a double-face grinding machine. The grinding pad cleaning device and the double-face grinding machine are characterized in that the grinding pad cleaning device comprises a cleaning liquid conveying arm, at least one upper nozzle, at least one lower nozzle and a water collecting groove; a pipeline used for conveying cleaning liquid is arranged in the cleaning liquid conveying arm; the upper nozzle and the lower nozzle communicate with the cleaning liquid conveying arm; and the upper nozzle is arranged in the water collecting groove, andthe water collecting groove is used for collecting the falling cleaning liquid. According to the grinding pad cleaning device of the embodiment, the water collecting groove is used for receiving thecleaning liquid which is injected to an upper grinding pad and then falls during cleaning, and the phenomenon that the cleaning liquid falls on a lower grinding pad to form an obstacle, and the cleaning efficiency is affected is avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor grinding, in particular to a grinding pad cleaning device and a double-sided grinding machine. Background technique [0002] The silicon double-side grinding process is used to remove the surface damage of the wafer that occurs during the forming process and to make a hard mirror surface of the wafer. Wherein, the carrier of the wafer is in contact with the surface of the polishing pad attached to the rotating upper / lower fixed plate, and rotates according to the rotation ratio of the internal gear and the external gear. At this time, the surface of the silicon wafer is ground due to the chemical reaction caused by the colloidal polishing slurry and the physical reaction caused by rotation and pressure. [0003] During the double-sided polishing process, due to the chemical reaction between the wafer and the polishing slurry and the friction between the polishing pad and the wafer, polishin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/08B24B37/34B08B3/02B08B13/00
CPCB08B3/02B08B13/00B24B37/08B24B37/34
Inventor 崔世勋
Owner XIAN ESWIN SILICON WAFER TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com