High-frequency high-speed main board mixed pressure processing manufacturing method

A manufacturing method and technology for motherboards, which are applied in multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve the problems of volatile, high viscosity point of Megtron6 ​​sheet, poor fluidity, etc., and achieve the effect of improving volatile

Pending Publication Date: 2019-10-15
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the existing technology, the processing of high-frequency and high-speed motherboards is difficult, and large-scale mass production cannot be realized. In particular, there is a lack of production experience for high-frequency and high-speed Megtron6 ​​boards with 10-layer motherboards.
In the production of the high-frequency and high-speed Megtron6 ​​sheet material 10-layer motherboard of the prior art, there are the following problems: 1. The AOI of the Megtron6 ​​sheet material is easy to report false points; 2. The viscosity point of the Megtron6 ​​sheet material is high and the fluidity is poor; 3. The Megtron6 ​​sheet material It contains some low-molecular-weight materials inside, which are volatile before curing; 4. Due to the formula of the Megtron6 ​​sheet itself, it has high hardness, and the drill group wears a lot, so it is not easy to drill holes; Immersion gold on the edge of the big gold surface is bad

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A method for manufacturing high-frequency and high-speed main board by mixed pressing, which is characterized in that it comprises the following steps: cutting → inner layer → inner layer AOI → pressing → drilling → removing glue → whole board electroplating → outer layer pattern transfer → Graphic plating→inspection→welding mask→text→gold→forming.

[0027] Further, the high-frequency and high-speed main board adopts PP board for cutting. When the PP board is cut, the table must be cleaned to avoid PP cross-contamination; the PP board must be sealed and stored before and after use, in an open environment Under 8 hours, temperature and humidity control conditions: ≤23℃, ≤50%;

[0028] Further, before the pressing process, the core board after the inner layer process needs to be oxidized, and oxidized by the browning method. After the browning, it is baked at 110°C for 2 hours; Bake at 130°C for 4 hours.

[0029] Furthermore, the time from the core board browning to the start ...

Embodiment 2

[0039] A method for manufacturing high-frequency and high-speed main board by mixed pressing, which is characterized in that it comprises the following steps: cutting → inner layer → inner layer AOI → pressing → drilling → removing glue → whole board electroplating → outer layer pattern transfer → Graphic plating→inspection→welding mask→text→gold→forming.

[0040] Further, the high-frequency and high-speed main board adopts PP board for cutting. When the PP board is cut, the table must be cleaned to avoid PP cross-contamination; the PP board must be sealed and stored before and after use, in an open environment Under 8 hours, temperature and humidity control conditions: ≤23℃, ≤50%;

[0041] Further, before the pressing process, the core board after the inner layer process needs to be oxidized, and oxidized by the browning method. After browning, it is baked at 120°C for 1 hour; Bake at ℃ for 3 hours.

[0042] Furthermore, the time from core board browning to the start of pressing i...

Embodiment 3

[0052] A method for manufacturing high-frequency and high-speed main board by mixed pressing, which is characterized in that it comprises the following steps: cutting → inner layer → inner layer AOI → pressing → drilling → removing glue → whole board electroplating → outer layer pattern transfer → Graphic plating→inspection→welding mask→text→gold→forming.

[0053] Further, the high-frequency and high-speed main board adopts PP board for cutting. When the PP board is cut, the table must be cleaned to avoid PP cross-contamination; the PP board must be sealed and stored before and after use, in an open environment Under 8 hours, temperature and humidity control conditions: ≤23℃, ≤50%;

[0054] Further, before the pressing process, the core board after the inner layer process needs to be oxidized, and oxidized by the browning method. After browning, it is baked at 115°C for 1.5 hours; Bake at ℃ for 3.5 hours.

[0055] Furthermore, the time from the core board browning to the start of p...

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PUM

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Abstract

The invention provides a high-frequency high-speed main board mixed pressure processing manufacturing method, which is characterized in that the method comprises the following steps: cutting-inner layer processing-inner layer AOI-pressing-drilling-degumming-whole plate electroplating-outer pattern transfer-pattern plating-in-process inspection- solder resist-text-chemical gilding-molding. The method can realize large-scale mass production of mixed pressure plates of high-frequency high-speed Megtron6 sheet 10 layers of main boards.

Description

Technical field [0001] The invention belongs to the field of circuit board processing technology, and specifically relates to a mixed pressure processing and manufacturing method of a high-frequency and high-speed Megtron6 ​​sheet 10-layer motherboard. Background technique [0002] The use of high-frequency sheets with lower dielectric constant and lower dielectric loss in printed circuit boards can meet the development requirements of high-frequency and high-speed signals. In printed circuit boards, local mixed voltage high-frequency material technology can be used to achieve It meets the transmission requirements of high-frequency and high-speed signals and can reduce the processing cost of printed circuit boards. [0003] However, in the existing technology, the processing of high-frequency and high-speed motherboards is difficult and cannot achieve large-scale mass production. In particular, there is a lack of experience in the production of hybrid boards for high-freq...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/0047H05K3/4611
Inventor 黄生荣刘德威邱成伟李小海
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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