Exposure equipment and exposure system

Abstract

The invention discloses exposure equipment and an exposure system. The exposure equipment comprises a substrate and a base, wherein the base is arranged on the substrate and is used for bearing the substrate, the exposure equipment is characterized by further comprising an adjustment device, and the adjustment device is arranged between the substrate and the base ad is used for adjusting curvatureor / and temperature. In the exposure equipment, the curvature or / and temperature of the base can be adjusted by the adjustment device, so that the curvature of a base surface is consistent with bending deformation of a mask, the curvature of a to-be-exposed substrate is also consistent with the bending deformation of the mask, and gaps in lower surfaces of the masks at different positions and an upper surface of the substrate are consistent; or / and the temperatures of the base at different positions can be adjusted by the adjustment device, so that the temperatures of the base at different positions are maintained consistent, and the linear width uniformity of the exposure substrate at different positions is improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an exposure device and an exposure system. Background technique [0002] In the manufacturing process of the display panel, a mask exposure process is often required. figure 1 It is a schematic diagram of the optical path of the proximity exposure equipment. In the actual mask exposure process, such as in proximity exposure equipment, such as figure 1 As shown, the illuminance distribution of the ultraviolet light projected on the equipment base from the high-pressure mercury lamp is uneven, and with the prolongation of the high-pressure mercury lamp, the illuminance distribution of the ultraviolet light projected on the equipment base also changes with time , resulting in a large difference in line width at different positions of the exposed product, and poor line width uniformity. [0003] In addition, in the mask exposure process, the bending deformation of the mask plate ...

AI Technical Summary

Problems solved by technology

The mask plate 13 is bent and deformed, resulting in inconsistent gaps between the lower surface of the mask plate 13 and the upper surface of the substrate 12 at different positions on the equipment base 21

In the proximity exposure process of array substrates, the exposure amount, uniformity of illumination and the gap between the lower surface of the mask and the upper surface of the substrate are the main parameters affecting product quality. When the mask at different positions on the equipment base When the gap between the lower surface and the upper surface of the substrate is inconsistent, it will lead to poor line width uniformity of exposed products

For example, in the case of using a negative photoresist, at the position where the distance between the lower surface of the mask plate and the upper surface of the substrate is small, the product line width at the corresponding position will be smaller; Where the distance from the upper surface is large, the line width of the product at the corresponding position will be too large, making the uniformity of the line width of the exposed product poor

[0004] There is no effective solution to the uneven distribution of ultraviolet rays and the bending and deformation of the mask plate. Therefore, it is urgent to solve the problem of poor line width uniformity of exposed products from other angles to improve the quality of exposed products.

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