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A method for preparing large-area copper Cu(111) single crystals

A single crystal, copper foil technology, applied in the field of materials, can solve problems such as limiting the application of copper foil

Active Publication Date: 2020-11-03
INST OF CHEM CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, commercially available commercial copper foils are all polycrystalline copper foils, in which there are a large number of grain boundaries, which limit the application of copper foils

Method used

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  • A method for preparing large-area copper Cu(111) single crystals
  • A method for preparing large-area copper Cu(111) single crystals
  • A method for preparing large-area copper Cu(111) single crystals

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] In the first step, the 100 μm thick commercial copper foil (purity 99.9%) is cut into a size of about 4cm × 6cm, and electrochemically polished in an ethanol / phosphoric acid system (wherein, the specific composition of the polishing solution is: deionized water ( mL), phosphoric acid (mL), ethanol (mL), isopropanol (mL) and urea (g) were mixed according to the ratio of 250:125:125:25:4; the condition of electrochemical polishing was: the holding voltage was 5V, the current is 2A, and the polishing time is 3min.) Wash with deionized water to remove residual polishing liquid on the surface, and blow dry with nitrogen.

[0039] In the second step, the copper foil obtained in the first step is placed in a high-temperature tube furnace, and 200 sccm of argon gas and 100 sccm of hydrogen gas are introduced to start heating. The temperature of the tube furnace was raised to 1075°C, and the heating time was 45 minutes. Hold for 1h for annealing. After cooling down to room tem...

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Abstract

The invention discloses a method for preparing a large-area monocrystal Cu (111). The method comprises is characterized in that a polycrystalline copper foil is treated several times to obtain the monocrystal Cu (111); every treatment successively comprises polishing and annealing; and the treatment frequency is not less than 3, and specifically is 3 or 4. The crystal faces of the copper foil obtained by the method are all (111) faces, and the area of the monocrystal Cu (111) is limited only by the size of a preparation container, so the method realizes large-area preparation of the monocrystal Cu, and has great application values.

Description

technical field [0001] The invention belongs to the field of materials and relates to a method for preparing large-area single crystal Cu(111). Background technique [0002] Metal copper is widely used in various fields because of its excellent properties. Copper foil, as a kind of copper, is a layer of continuous metal foil with a thickness of microns obtained by depositing metal copper on the substrate of the circuit board. Copper foil has the characteristics of low surface oxygen, excellent tensile strength and ductility, excellent electrical conductivity and high catalytic performance. It is used in electromagnetic shielding and antistatic, copper clad laminates, printed circuit boards, lithium ion secondary There are a wide range of applications in the fields of batteries and metal catalysis. However, commercially available commercial copper foils are all polycrystalline copper foils, in which there are a large number of grain boundaries, which limit the application o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B1/02C30B29/02C30B33/02C30B33/00C22F1/08
CPCC22F1/08C30B1/02C30B29/02C30B33/00C30B33/02
Inventor 武斌张家宁杨贺刘云圻
Owner INST OF CHEM CHINESE ACAD OF SCI
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