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Probe card, detection device and wafer detection method

A technology of probe cards and probes, which is applied in the field of detection devices and probe cards, can solve the problems of high cost of detection and difficulty in detecting the optical performance of light source chips, and achieve the effects of reducing production costs and improving detection efficiency

Active Publication Date: 2022-04-19
VERTILITE CO LTD
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  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a probe card, a detection device and a wafer detection method, which are used to solve the problem of high detection cost and the difficulty in optically performing simultaneous optical processing on the light source chip in the prior art. Performance testing and electrical performance testing issues

Method used

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  • Probe card, detection device and wafer detection method
  • Probe card, detection device and wafer detection method
  • Probe card, detection device and wafer detection method

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Embodiment Construction

[0037] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0038] It should be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic ideas of the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in ...

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Abstract

The present invention provides a probe card, a detection device and a wafer detection method, wherein the probe card includes: a circuit board having a hole and a conductive pattern; an image receiving component arranged on the circuit board The first surface; the probe assembly is arranged on the second surface of the circuit board; the optical shaping element is arranged on one side of the image receiving assembly; the probe assembly of the probe card electrically contacts the light source chip on the wafer The electrical conduction of the light source chip can be realized, and the optical performance detection of the light source chip can be realized through the image connection component and the optical shaping element. Optical performance testing and electrical performance testing are carried out, which improves the detection efficiency and reduces the production cost.

Description

technical field [0001] The invention relates to the field of microelectronic testing, in particular to a probe card, a detection device and a wafer detection method. Background technique [0002] Traditionally, the packaged light source module is inspected. At this time, the light source module has integrated the light source chip and the corresponding optical components, etc., and the quality screening of the packaged light source module is carried out. When the optical performance of the light source module is detected Or when the electrical performance does not meet the testing standards, the unqualified is the light source module including the light source chip and optical components, that is, the scrapped light source chip and optical components instead of just the light source chip, and the cost of testing is high. In addition, in the traditional way It is difficult to simultaneously perform optical performance testing and electrical performance testing on the light so...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G01R1/04G01M11/02G01J1/00
CPCG01R31/2851G01R1/0491G01M11/02G01J1/00
Inventor 张成梁栋饶志龙刘嵩
Owner VERTILITE CO LTD
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