Flat plate electroplating experiment device for electrolytic copper foil

Abstract

The invention discloses a flat plate electroplating experiment device for electrolytic copper foil. The device comprises an electrolytic cell, a liquid storage tank, an electrolyte circulating system,a temperature control system and a power supply; a cathode titanium plate and an anode plate are arranged in the electrolytic cell; the power supply is a low-voltage high-current rectifier; the electrolyte circulating system is composed of a magnetic pump a valve, a flow meter and a pipeline connected between the liquid storage tank and the electrolytic cell, overflow plates on the two sides of the electrolytic cell, overflow holes positioned in a bottom plate of the electrolytic cell and the like; the temperature control system consists of a temperature controller and a heating rod which isconnected with the temperature controller and is arranged at the lower end of the liquid storage tank; and the anode plate and the cathode plate are parallel to each other and the distance between theanode plate and the cathode plate is adjustable. By means of the flat plate electroplating device, the condition of an electrolytic copper foil production line can be well simulated, the process parameters are convenient to adjust, and the influence of each parameter on the copper foil performance is easily analyzed.

Description

technical field [0001] The invention relates to an electroplating device, in particular to a flat plate electroplating experimental device for electrolytic copper foil. Background technique [0002] At present, most countries in the world use the roll-type continuous electrolysis method to produce electrolytic copper foil. This method uses copper sulfate solution as the electrolyte, and performs electrolysis in an electrolytic cell with an insoluble material as the anode and a cathode roller that rotates at a constant speed as the cathode. The copper in the solution is deposited on the surface of the cathode roller to form a copper foil, and then it is continuously peeled off from the cathode roller, washed, dried, and coiled to make the original foil, and then the surface of the original foil is treated according to the use requirements. Among them, the raw foil manufacturing process includes dissolving copper to make liquid, filtering and purifying, adjusting temperature, ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to design a flat plate electroplating experimental device for electrolytic copper foil, to overcome the problem that the existing experimental device cannot simulate the actual electrolytic copper foil production line, and to carry out some exploratory experiments more conveniently

Images