A double-layer passivation film for front contact passivation and preparation method thereof
A technology of front contact and passivation film, which is applied in the field of solar cells, can solve problems such as limiting the efficiency of PERC cells, and achieve the effect of less parasitic absorption
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Embodiment 1
[0029] A preparation method for a double-layer passivation film for front contact passivation, said preparation method comprising the following steps:
[0030] (1) Texturing. With the P-type single crystal silicon wafer 1 as the silicon substrate, the texturing treatment is first performed, and the solution used is usually a KOH solution, and the KOH solution is based on KOH: additive: H 2 The ratio of O=20:3:160 is prepared, and the temperature is 80°C. Then wash in 2-5% HF solution to clean the surface of the silicon wafer;
[0031] (2) Phosphorus diffusion. In a conventional phosphorus diffusion furnace tube, a phosphorus diffusion process is performed to form a pn junction 2 . The diffusion temperature is between 700-900 degrees, and the formed sheet resistance ranges from 80-200ohm / □.
[0032] (3) Remove the back knot. First protect the front with water film, in HF / HNO 3 Remove the phosphosilicate glass and the back diffusion layer in the back surface field area in ...
Embodiment 2
[0041] A preparation method for a double-layer passivation film for front contact passivation, said preparation method comprising the following steps:
[0042] (1) Texturing. With the P-type single crystal silicon wafer 1 as the silicon substrate, the texturing treatment is first performed, and the solution used is usually a KOH solution, and the KOH solution is based on KOH: additive: H 2 The ratio of O=20:3:140 is prepared, and the temperature is 80°C. Then wash in 2-5% HF solution to clean the surface of the silicon wafer;
[0043] (2) Phosphorus diffusion. In a conventional phosphorus diffusion furnace tube, a phosphorus diffusion process is performed to form a pn junction 2 . The diffusion temperature is between 700-900 degrees, and the formed sheet resistance ranges from 80-200ohm / □.
[0044] (3) Remove the back knot. First protect the front with water film, in HF / HNO 3 Remove the phosphosilicate glass and the back diffusion layer in the back surface field area in ...
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