Manufacturing method of flexible substrate and flexible packaging structure

Abstract

The invention provides a manufacturing method of a flexible substrate, and the method comprises the following steps: providing the flexible substrate; manufacturing a first groove on the flexible substrate; manufacturing a connecting circuit in the first groove; and manufacturing a dielectric insulating layer on the connecting circuit. The flexible substrate manufactured by adopting the manufacturing method of the flexible substrate can better meet the requirements of a flexible packaging structure on the flexible substrate, and meanwhile, the layout of a connecting circuit can be accurately controlled.

Description

[0001] This application is a divisional application for an invention patent with an application date of February 14, 2018, an application number of 201810151646.8, and a patent titled "Flexible Substrate, Manufacturing Method, and Flexible Packaging Structure". technical field [0002] The invention relates to the field of semiconductor system-level packaging, in particular to a method for manufacturing a flexible substrate and a flexible packaging structure. Background technique [0003] In recent years, wearable devices have become more and more popular, and wearable devices have been used more and more in fields such as soldiers' field operations or training, athlete training, physical fitness monitoring of exercisers, and health monitoring. In order to collect information more accurately, how to make wearable devices flexible so that they can be closer to the curve of the human body itself has become the focus of major manufacturers and laboratories. The flexibility of w...

AI Technical Summary

Problems solved by technology

In the production process, it is mainly based on PI materials such as lithography and other technologies, which cannot well meet the requirements of system integration in the emerging flexible electronics technology field, such as: manufacturing costs, flexible ductility, integrated manufacturing processes, etc.

Some enterprises or scientific research institutions have begun to study the printing process based on PET and other materials, but the manufacturing line accuracy and line width cannot meet the requirements of complex system-level packaging substrates

Using conventional printing technology, there are constant difficulties and many problems in process control for the requirements of low thin line width, high conductivity and good shape flatness.

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