MEMS sensor thermal parameter testing circuit and testing method

A parametric test and sensor technology, applied in optical radiation measurement, radiation pyrometry, instruments, etc., can solve the problems of device processing error, complex test system, long design cycle, etc., achieve small changes, achieve chip-level integration, speed quick effect

Active Publication Date: 2019-08-16
WUXI INNOVATION CENT CO LTD
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the determination of the structure and process size for thermal parameter design mainly relies on simulation, estimation and other methods, which have errors with the actual processing of the

Method used

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  • MEMS sensor thermal parameter testing circuit and testing method
  • MEMS sensor thermal parameter testing circuit and testing method
  • MEMS sensor thermal parameter testing circuit and testing method

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Embodiment Construction

[0046] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0047] As the first embodiment of the first aspect of the present invention, a MEMS sensor thermal parameter test circuit based on integral operation is provided, such as figure 1 and figure 2 As shown, a thermal parameter test circuit of a diode-type infrared focal plane array sensor is taken as an example.

[0048]The MEMS sensor thermal parameter testing circuit based on the integral operation includes: a power module, a MEMS sensor array 100, an array gate switch, an operation circuit 300 and a data processing unit 400;

[0049] The MEMS sensor array 100 includes sensitive units in multiple rows and columns, and each sensitive unit will self-heat after being powered on and generate an electrical signal corresponding to its temperature. The electrical signal in this embodiment is a voltage signal;

[0050] The array selection switch is used to sequentiall...

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Abstract

The invention relates to an electricity self-testing field of the thermal parameter of the micro-nano device, and specifically relates to a MEMS sensor thermal parameter testing circuit and a testingmethod. The MEMS sensor thermal parameter testing circuit comprises a MEMS sensor array including multiple lines and multiple rows of sensitive units, wherein each sensitive unit can self-heat after being electrified and produce an electricity signal corresponding to the temperature thereof; an array gating switch for orderly gating the sensitive units in the MEMS sensor array in turn, and outputting the electricity signal produced by the selected sensitive unit to an operational circuit; the operational circuit for performing amplifying operation on the change of the electricity signal, and outputting the amplifying operation result to a data processing module; a power supply module for supplying power for the sensitive unit selected by the array gating switch; and the data processing unit for computing according to the actual testing data of the operational circuit so as to obtain device thermal capacity C, thermal response time t and thermal conductance G. The testing circuit disclosed by the invention has the features of being simple in circuit, simple and convenient to operate, fast in measurement speed and high in precision.

Description

technical field [0001] The invention relates to the field of electrical self-testing of thermal parameters of micro-nano devices, in particular to a MEMS sensor thermal parameter testing circuit based on an arithmetic circuit. Background technique [0002] Micro-electromechanical systems (MEMS), also known as micro-electro-mechanical systems or micro-mechanical systems, are developed on the basis of microelectronics technology (semiconductor manufacturing technology). Common products include accelerometers, microphones, gyroscopes, humidity sensors, gas sensors, infrared sensors, and more. At present, thermal MEMS sensors based on the principle of thermal characteristics are widely used in national defense, medical, security, aerospace, environmental monitoring, automotive electronics and other fields, and have the characteristics of miniaturization, intelligence, multi-function, high integration and mass production. [0003] Thermal MEMS sensors include two parts: a sensit...

Claims

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Application Information

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IPC IPC(8): G01J5/20G01J5/24
CPCG01J5/20G01J5/24G01J2005/204G01J5/80
Inventor 刘超傅剑宇侯影刘瑞文陈大鹏
Owner WUXI INNOVATION CENT CO LTD
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