Grinding and polishing apparatus and grinding and polishing method

Abstract

A grinding and polishing apparatus and a grinding and polishing method are provided to eliminate the problem of a large and complex structure of a grinding and polishing apparatus resulting from the formation of a water seal by different mechanisms and the cooling of a table. The grinding and polishing device (1) comprises a holding unit (5), grinding units (30, 31) and a polishing unit (4). The holding unit comprises a porous plate (50) having a wafer holding surface and a frame (51) having a recess (511a) for exposing the holding surface and accommodating the porous plate, wherein the framehas a suction path (510) for communicating a lower surface (511b) of the frame with a bottom surface of the recess and connecting a lower surface side with a suction source (59); and a communicating path which communicates the lower surface with the upper surface on the outside of the recess, and a water supply source (57) is connected to the lower surface side. The grinding and polishing apparatus has a unit (9) that controls the amount of water in a case where a water seal is formed between a wafer and the holding surface by spraying water from a discharge port obtained by opening the communicating path on the upper surface, and the amount of water in a case where the holding unit is cooled.

Description

technical field [0001] The present invention relates to a grinding and grinding device and a grinding and grinding method, and relates to a device and a method for performing grinding and grinding on workpieces such as semiconductor wafers. Background technique [0002] Conventionally, there is a grinding and polishing apparatus that grinds a wafer warped on the outer peripheral side while holding the wafer on a holding table, and grinds the ground wafer. In such a grinding and polishing apparatus, water is supplied from a water supply unit to the outer periphery of the wafer through nozzles to form a water seal in order to suck and hold a warped wafer by the holding table without vacuum leakage. [0003] And, in order to ensure that the formed water seal is moved from the loading and unloading area where the wafer is carried in and out with respect to the holding table on the grinding and grinding device to the grinding area where the wafer is ground, the holding table is n...

AI Technical Summary

Problems solved by technology

[0006] Conventional grinding and polishing equipment has a nozzle mechanism for forming a water seal and a cooling mechanism for cooling the holding table during grinding, so there is a problem that the structure of the equipment is large and complicated.

[0007] Therefore, in the grinding and grinding apparatus, there is a problem to be solved in that the formation of the water seal and the cooling of the maintenance table are performed by different mechanisms, so that the apparatus structure is large and complicated.

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