Semiconductor elongated strip and method for processing same

A processing method and semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems affecting semiconductor performance, affecting the formation of semiconductor final products, etc., to achieve the effect of reducing stress and avoiding bending or deformation

Pending Publication Date: 2019-08-06
SAE TECH DELEVOPMENT DONGGUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In actual processing procedures, semiconductor strips are often bent due to the influence of their own stress, and this bending condition usually affects the formation of normal semiconductor final products, thereby affecting the performance of semiconductors

Method used

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Examples

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Embodiment Construction

[0022] The semiconductor strip and the processing method thereof of the present invention will be further described below in conjunction with the examples, but the present invention is not limited thereto. The semiconductor strips of the present invention include, but are not limited to, magnetic head strips, for example in the field of disk drives.

[0023] In one embodiment, the semiconductor strip is composed of a plurality of semiconductor units, which are cut into individual semiconductor units by processing. Specifically, at least one groove is formed on a predetermined surface of the strip body, and the groove is located at a cutting position between two adjacent semiconductor units, that is, the groove is a cutting position of a cutting tool. By forming grooves on the cutting surface of the strip in advance, the stress on the semiconductor strip itself during cutting can be reduced, thereby reducing the bending and deformation of the strip. The predetermined surface m...

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PUM

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Abstract

The method for processing a semiconductor elongated strip comprises the steps of: providing a semiconductor elongated strip; plating a predetermined surface of the semiconductor elongated strip with aprotective film; covering the protective film with a photosensitive film; covering the predetermined surface with a trench-shaped shielding cover for exposure and ion etching; and removing the photosensitive film. The method can reduce the bending and the deformation of the elongated strip during a cutting process, thereby ultimately improving the performance of a semiconductor product.

Description

technical field [0001] The invention relates to a semiconductor processing method, in particular to a semiconductor strip and a processing method thereof. Background technique [0002] Semiconductor strips are the transitional part between the wafer and the semiconductor in the semiconductor processing industry. First the wafer will be cut into multiple strips, and then the strips will be cut into multiple independent semiconductor units. In the actual processing procedure, the semiconductor strip is often bent due to the influence of its own stress, and this bending usually affects the formation of the normal final semiconductor product, thereby affecting the performance of the semiconductor. [0003] Therefore, it is urgent to provide an improved method for processing semiconductor strips to overcome the above defects. Contents of the invention [0004] An object of the present invention is to provide a method for processing semiconductor strips, which can reduce the b...

Claims

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Application Information

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IPC IPC(8): H01L21/304H01L21/3065
CPCH01L21/3043H01L21/3065
Inventor 郭振新
Owner SAE TECH DELEVOPMENT DONGGUAN
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