Soldering flux composition, soldering flux composition and electronic substrate
A composition and flux technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problem of stickiness of flux residues, and achieve the effect of inhibiting stickiness and cracking
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Embodiment 1
[0092] 34% by mass of rosin-based resin A, 10% by mass of rosin ester, 4% by mass of activator A, 3% by mass of activator B, 5% by mass of activator C, 0.5% by mass of activator D, 0.5% by mass of activator E, 23% by mass of solvent A, 10% by mass of solvent B, 3% by mass of thixotropic agent A, 2% by mass of thixotropic agent B, 1% by mass of thixotropic agent C, 2% by mass of antioxidant A, and 2% by mass of antioxidant B It was thrown into a container, mixed using a planetary mixer, and obtained a flux composition.
[0093] Then, 11% by mass of the obtained flux composition and 89% by mass of the solder powder (100% by mass in total) were put into a container and mixed with a planetary mixer to prepare a solder composition. The viscosity (measurement temperature: 25° C.) of this solder composition was 210 Pa·s, and the thixotropic index was 0.580.
Embodiment 2~4
[0095] A flux composition and a solder composition were obtained in the same manner as in Example 1 except that each material was blended in the composition shown in Table 1.
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