Novel application of sulfonic acid group aromatic compounds

Abstract

The invention relates to a novel application of sulfonic acid group aromatic compounds, and in particular relates to the sulfonic acid group aromatic compounds with the structure in the formula (I) orapplication of salt of the sulfonic acid group aromatic compounds in electroless copper plating on surface of non-metal base materials substrate; pre-immersion liquid treatment of the non-metal basematerials using sulfonic acid group aromatic compounds with the structure in the formula (I), and after the activation step, enabling the palladium ions to be more uniformly adsorbed on the base materials, the adsorption amount is large. The adsorption amount of the palladium can be ensured even in an activation solution with relatively low concentration of the palladium ions.

Description

technical field [0001] The invention relates to the field of electroless copper plating on the surface of non-metal substrates, in particular to the new application of sulfonic acid aromatic compounds. Background technique [0002] At present, the production process of printed circuit boards usually includes the process of metallizing the surface of the non-metallic substrate (especially the hole wall). Electroless copper plating is a common method of metallizing non-metallic surfaces, and the process of electroless copper plating requires the formation of a layer of active catalytic centers on the surface of non-metallic substrates to catalyze the deposition of copper ions on the surface of the substrate. Palladium metal has been used as the active catalytic center of electroless copper plating because of its good catalytic activity and the ability to improve the bonding force between the copper layer and the surface of the substrate. At present, palladium catalytic system...

AI Technical Summary

Problems solved by technology

Compared with the colloidal palladium activation system, the ionic palladium system has better stability, but the palladium ions in the ionic palladium have poor adhesion on the non-metallic substrate and are prone to uneven distribution, resulting in missed plating in the subsequent electroless copper plating

If it is necessary to increase the concentration of palladium ions in the activation solution in order to ensure that the palladium ions can completely cover the surface of the substrate, the consumption of precious metal palladium will be too large and the cost will be too high.

[0003] In order to solve the above-mentioned problems of incomplete coverage of palladium ions and poor adhesion, technicians will pre-dip before activation, but the existing pre-dip solution still has the following problems: the ability to adjust the surface charge of the substrate is still insufficient, resulting in subsequent activation. In the step, there are still problems of low adsorption amount and uneven adsorption of palladium ions on the surface of the substrate, which will still increase the consumption of palladium and cause the problem of high cost

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