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Thin cover film with EMI function

A covering film and functional technology, applied in the direction of film/sheet release liner, film/sheet adhesive, electrical components, etc., can solve problems such as difficult to reach, EMI shielding film thickness and harsh shielding function

Pending Publication Date: 2019-07-12
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, today's EMI shielding film has more stringent requirements on its thickness and shielding function. The shielding rate of conventional covering film is generally around 55dB, and it is difficult to achieve 70dB or even higher shielding effect. Therefore, on the basis of pursuing thinness, do It is also one of the difficulties to achieve a high occlusion rate

Method used

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  • Thin cover film with EMI function
  • Thin cover film with EMI function
  • Thin cover film with EMI function

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Embodiment Construction

[0042] In order to be able to understand the technical means of the present invention more clearly and implement it according to the contents of the description, the specific implementation of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but not to limit the scope of the present invention.

[0043] combined with figure 1 And attached figure 2 The cover film described in this application is described in further detail.

[0044] Such as figure 1 Shown is one of the cover film structures described in this application:

[0045] A thinned cover film with EMI function, comprising a stacked carrier layer 1, a first insulating layer 2, a metal layer 3, a first adhesive layer 4, a second insulating layer 5, a second adhesive layer 6 and a release layer Type Layer 7.

[0046] The thickness of the carrier layer 1 is 25-100 μm, and it ...

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Abstract

The invention discloses a thin cover film with an EMI function. The thin cover film comprises a carrier layer, a first insulating layer, a metal layer, a second insulating layer, a second adhesive layer and a release layer which are stacked. The cover film has a function of insulating the cover film from an electronic circuit surface, and has a function of shielding a transmission signal. In the manufacturing process, the cover film and a shielding film are combined into one, and in view of the difficulty in the processes of the cover film and the shielding film, a thickness less than that ofthe cover film is achieved and can even reach 9 to 10[mu]m, thereby reducing the process steps and reducing the production cost without affecting the function of a product. In the physical propertiesof the product, the surface has high hardness, very low gloss, good mechanical Performance, and a good shielding effect. In the later storage, since the EMI function is included in the cover film, thethin cover film can be stored in the manner of a conventional cover film.

Description

technical field [0001] The invention relates to a covering film for a flexible circuit board, in particular to a thinned covering film with an EMI function, and belongs to the technical field of functional films for a flexible circuit board. Background technique [0002] Under the market demand that electronic and communication products tend to be multi-functional and complex, the structure of the circuit substrate needs to be lighter, thinner, shorter and smaller, and the function needs to be powerful and high-speed signal transmission. [0003] With the gradual development of electronic products on the market in the direction of thinner and thinner, many important customers need upstream suppliers to provide FPC circuit boards covered on the FPC circuit board according to their production needs in order to reduce the overall thickness of the soft board material during the production of FPC multilayer boards. Cover film products with ultra-thin thickness. At present, most ...

Claims

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Application Information

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IPC IPC(8): H05K9/00C09J7/29C09J7/40
CPCH05K9/0084H05K9/0088C09J7/29C09J7/40C09J2203/326C09J2301/16
Inventor 林志铭李建辉周艳君韩贵周敏
Owner KUSN APLUS TEC CORP
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