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Micro hole heat dissipation device

A heat dissipation device and microporous technology, applied in indirect heat exchangers, lighting and heating equipment, etc., to achieve the effect of simple structure and efficient heat dissipation

Active Publication Date: 2019-07-09
ZHONGBEI UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem of high-efficiency heat dissipation of heat sources such as engines or electric motors, the present invention proposes a microporous heat dissipation device that comprehensively utilizes physical principles such as water evaporation heat absorption, capillary action, and memory alloy deformation to consume a relatively small amount of water for efficient heat dissipation

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Embodiment Construction

[0021] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other implementations obtained by persons of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.

[0022] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0023] A microporous heat dissipation device, comprising an inner steel plate 5 coated on a heating device that needs to be dissipated, and a plurality of memory alloy deformation zones 2 that can store water on the outer surface of the inner steel plate 5, located outside the inner steel plate 5 The outer steel plate 1 on on...

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Abstract

The invention relates to a heat dissipation device, in particular to a micro hole heat dissipation device which achieves heat dissipation through the combination of the capillary effect and the waterevaporation heat absorption characteristic. The micro hole heat dissipation device comprises an inner-layer steel plate covering a heating device needing to be subjected to heat dissipation, multiplememory alloy deformation areas which are formed on the outer side face of the inner-layer steel plate and can store water, and an outer-layer steel plate located on one side of the outer side face ofthe inner-layer steel plate. A circumferential sealing pad is sealed between the inner-layer steel plate with the memory alloy deformation areas and the outer-layer steel plate, at least one water inlet communicating with the memory alloy deformation areas is formed in the inner-layer steel plate, and water way channels used for communicating with the adjacent memory alloy deformation areas are formed at the positions, between the adjacent memory alloy deformation areas, on the inner-layer steel plate. By means of the micro hole heat dissipation device, deformation, changing along with the temperature, of a round-trip memory alloy is utilized, and flowing of water is flexibly controlled according to the temperature; and the physical principle and the capillary phenomenon are utilized, thestructure is simple, water evaporation heat absorption is used for replacing traditional heat dissipation conducted through water circulation, and therefore heat dissipation can be more efficient.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a microporous heat dissipation device which realizes heat dissipation by combining capillary action and water evaporation heat absorption characteristics. Background technique [0002] The engine of fuel vehicles and the electric motor of electric vehicles are important power devices of vehicles at present. During the process of converting the chemical energy of fuel or batteries into mechanical energy, part of the energy is converted into heat. Overheating of the engine or electric motor will affect its performance, and thermal radiation will affect its performance. surrounding parts. [0003] A conventional radiator consists of three parts: the coolant inlet chamber, the coolant outlet chamber, and the radiator core. The coolant flows inside the radiator core, and the air passes outside the radiator. The hot coolant dissipates heat to the air. When it gets colder, the cold air heat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04F28D15/06
CPCF28D15/046F28D15/06
Inventor 马铁华刘国东郭文超陈昌鑫武耀艳裴东兴靳鸿沈大伟孙传猛
Owner ZHONGBEI UNIV
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