Multifunctional synaptic bionic device and preparation method thereof
A multifunctional and synaptic technology, applied in the field of artificial nerves, can solve the problems of complex circuits, high power consumption, and affecting device integration, and achieve the effects of easy integration, low power consumption, and simple preparation methods
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Embodiment 1
[0020] Such as figure 1 As shown, the bionic device of this embodiment includes a copper gate 1 from bottom to top, a silicon substrate layer 2 with a resistivity of 0.001-10Ωcm, a thickness of 200-500 μm, and a silicon dioxide film layer 3 with a thickness of 30-100 nm. Wherein, the upper surface of the silicon dioxide thin film layer 3 is respectively provided with a first copper intermediate electrode 4 and a second copper intermediate electrode 5 with a pitch of 1-3 μm, and the first copper intermediate electrode 4 and the second copper intermediate electrode 5 pass through a length of Titanium dioxide nanowires 6 with a thickness of 1.5-4 μm are connected to each other, and a copper source 7 and a copper drain 8 are respectively provided on the upper surfaces of the first copper intermediate electrode 4 and the second copper intermediate electrode 5 . The thickness of the first copper intermediate electrode 4 and the second copper intermediate electrode 5 is 50-80 nm, and...
Embodiment 2
[0028] The bionic device of this embodiment comprises a platinum gate 1, a silicon substrate layer 2 with a resistivity of 0.001-10 Ωcm, a thickness of 200-500 μm, and a silicon dioxide thin film layer 3 of a thickness of 30-100 nm from bottom to top. Wherein, the upper surface of the silicon dioxide film layer 3 is respectively provided with the first platinum intermediate electrode 4 and the second platinum intermediate electrode 5 with a pitch of 1-3 μm, and the first platinum intermediate electrode 4 and the second platinum intermediate electrode 5 have a passing length of Titanium dioxide nanowires 6 of 1.5-4 μm are connected to each other, and the upper surfaces of the first platinum intermediate electrode 4 and the second platinum intermediate electrode 5 are respectively provided with a platinum source 7 and a platinum drain 8 . The thickness of the first platinum intermediate electrode 4 and the second platinum intermediate electrode 5 is 50-80 nm, and the thickness of...
Embodiment 3
[0036] The bionic device of this embodiment comprises a gold gate 1, a silicon substrate layer 2 with a resistivity of 0.001-10Ωcm, a thickness of 200-500 μm, and a silicon dioxide film layer 3 of a thickness of 30-100 nm from bottom to top. Wherein, the upper surface of the silicon dioxide thin film layer 3 is respectively provided with the first gold intermediate electrode 4 and the second gold intermediate electrode 5 with a pitch of 1-3 μm, and the first gold intermediate electrode 4 and the second gold intermediate electrode 5 have a passing length of Titanium dioxide nanowires 6 of 1.5-4 μm are connected to each other, and the upper surfaces of the first gold intermediate electrode 4 and the second gold intermediate electrode 5 are respectively provided with a gold source 7 and a gold drain 8 . The thickness of the first gold intermediate electrode 4 and the second gold intermediate electrode 5 is 50-80 nm, and the thickness of the gold source 7 , gold drain 8 and gold ga...
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