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TFT substrate based on flexible material

A technology of flexible materials and flexible substrates, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of serious heat dissipation of substrates, poor reliability, unfavorable panels, etc., to achieve good heat dissipation, cheap and easy to obtain environment, increase heat dissipation effect of ability

Inactive Publication Date: 2019-06-21
XIANGTAN HONGDA VACUUM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of display is soft and portable, has strong impact resistance, and can realize curly display; however, the current plastic substrate has poor surface flatness, and micron-scale bumps on the surface will cause device damage and poor reliability; The thermal expansion coefficients of the layers are different, and the growth of the film, heat treatment, etc. will cause bending and shrinkage, which is not conducive to the alignment of photolithography patterns, and is also not conducive to panel production.
[0005] Due to the long-term use of TFT substrates, substrates including TFT substrates have serious heat dissipation problems. If this problem is not improved, the use and promotion of TFT substrates made of invisible flexible materials will be seriously affected.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The TFT substrate provided by the present invention will be further described in detail and completely below in conjunction with the embodiments. The embodiments described below are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0020] The experimental methods in the following examples are conventional methods unless otherwise specified. The experimental materials used in the following examples were purchased from the market unless otherwise specified.

[0021] The heat dissipation substrate in the present invention includes: a flexible substrate, a heat dissipation layer, a TFT layer and a display layer. The display layer is an OLED layer, and the OLED layer includes an anode metal layer, an organic layer and a cathode metal layer. The OLED layer is formed by ink-jet printing or vacuum evaporation and by planar film formation or roll-to-roll process. Specifically, in this embodiment, the OLED layer...

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PUM

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Abstract

The invention discloses a TFT substrate based on a flexible material. The TFT substrate based on the flexible material comprises a flexible base material, a heat dissipation layer, a TFT layer and a display layer in sequence. The display layer is an OLED layer. The OLED layer comprises an anode metal layer, an organic layer and a cathode metal layer. According to the TFT substrate, in a mode of adding the heat dissipation layer, heat dissipation capability of the TFT substrate itself is increased; the added heat dissipation layer has certain connection effect, so an original bridge connectionlayer can be replaced by the heat dissipation layer to a certain degree, and the heat dissipation layer works in bridge connection and heat dissipation; a material of the heat dissipation layer is cheap, is easy to get and is environmentally friendly; and through evaporation, the TFT substrate based on the flexible material with good heat dissipation can be obtained.

Description

technical field [0001] The invention relates to a TFT substrate based on flexible materials, which belongs to the field of vacuum evaporation. Background technique [0002] With the popularity of portable mobile devices, flat panel displays have been widely used due to their thin and light bodies, low energy consumption, and no radiation. Existing flat panel displays mainly include liquid crystal displays (Liquid Crystal Display, LCD) and organic light emitting diode display devices. Compared with LCD, OLED has the advantages of no need for backlight, high contrast, thin thickness, wide viewing angle, fast response, wide application range, and simple production, etc., and has gradually occupied the mainstream of the market. [0003] Basically all TFT substrates are not resistant to high temperatures, so the TFT process must be carried out at a relatively low temperature. The silicon layer used is amorphous silicon or polysilicon layer produced by silicide gas. The developme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L27/12H01L27/32
Inventor 祝海生黄乐陈立凌云黄夏孙桂红黄国兴
Owner XIANGTAN HONGDA VACUUM TECH CO LTD
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