Substrate composition and substrate prepared therefrom

A composition and substrate technology, applied in the direction of circuit substrate materials, coatings, printed circuit components, etc., can solve the problems of poor mechanical strength, difficult processing, and insufficient rigidity of the substrate

Active Publication Date: 2019-06-21
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the rigidity of polytetrafluoroethylene (PTFE) material itself is not enough. In addition to being difficult to carry out subsequent processing, the mechanical strength of the obtained substrate is also poor.

Method used

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  • Substrate composition and substrate prepared therefrom
  • Substrate composition and substrate prepared therefrom
  • Substrate composition and substrate prepared therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034]First, 4 grams of trimethyl isocyanurate (trimethallyl isocyanurate, TMAIC) (purchased from Hunan Farida Technology Co., Ltd.) and 1.2 grams of dicumyl peroxide (dicumylperoxide) were dissolved in 36 gram of methyl ethyl ketone (methyl ethyl ketone), to obtain a solution containing trimethylallyl isocyanurate (TMAIC solution). Next, 27.5 grams of silicon dioxide (average particle diameter of 25 nm, purchased from US Silica), 37.5 grams of polytetrafluoroethylene dispersion (PTFE dispersion) (purchased from DuPont, wherein the PTFE content is 60% (22.5 grams) ), and 0.1 gram of the above-mentioned solution containing trimethylallyl isocyanurate (wherein the content of trimethylallyl isocyanurate is 0.0097 gram) is mixed. After drying to remove part of the solvent, the substrate composition (1) is obtained.

Embodiment 2

[0036] The preparation method of the substrate composition (1) described in Example 1 was carried out, except that the solution containing trimethylallyl isocyanurate was increased from 0.1 g to 0.25 g to obtain the substrate composition (2).

Embodiment 3

[0038] The preparation method of the substrate composition (1) described in Example 1 was carried out, except that the solution containing trimethylallyl isocyanurate was increased from 0.1 g to 0.5 g to obtain the substrate composition (3).

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Abstract

A substrate composition and a substrate prepared from the substrate composition are provided. The substrate composition includes 25-80 parts by weight of a polymer, 20-75 parts by weight of an inorganic filler, and 0.015-0.7 part by weight of a compound. The total weight of the polymer and the inorganic filler are 100 parts by weight. The polymer is selected from a group consisting of polytetrafluoroethylene (PTFE) and perfluoroalkoxy alkane (PFA). The compound has at least three terminal vinyl groups.

Description

[0001] 【Technical field】 [0002] The present disclosure relates to a substrate composition and a substrate prepared from the substrate composition. [0003] 【Background technique】 [0004] Electronic products in the new century tend to be light, thin, short, and small, and transmit at high frequencies, so that the wiring of printed circuit boards must be high-density to increase transmission speed while maintaining signal integrity. Electronic products adopt multi-layer semiconductor components and sophisticated packaging technology, and achieve high density of multi-layer circuit boards through advanced bonding and mounting technology. [0005] In the field of electronic components, there has been an urgent need for high-frequency communication equipment, so related electronic component materials have recently been required, such as semiconductor sealing materials with low dielectric constants and materials with low dielectric loss factors, thereby Data can be transmitted qu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/18C08K3/36C08J5/18C08J3/24H05K1/03
CPCC09D127/18C08K5/34924C08K3/36C08K5/14C08K5/549C08G77/20C08K3/013C08L83/04C08K13/02C08L27/18C08L2203/20C08L2205/02C08L2203/16
Inventor 黄仕颖
Owner IND TECH RES INST
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