Wafer transfer and measurement system

Abstract

The invention relates to the technical field of transmission equipment, and relates to a wafer transfer device and a measurement method. The wafer transfer device comprises an atmospheric transmissiondevice, a wafer loading chamber, a vacuum transmission device and a wafer processing chamber, wherein each of the wafer loading chamber and the wafer processing chamber comprise a chamber main body,a transparent window, a transmission device and a wafer position detection device; and the system is used for detecting the wafers when the wafers are placed in the wafer loading chamber and the waferprocessing chamber. According to the system, the wafers are placed in the loading chamber and the processing chamber for detection, so that the detection result is more real and accurate, and the deviation caused by relative sliding of the wafer and a support in the placing process is avoided.

Description

technical field [0001] The invention relates to the technical field of transmission equipment, in particular to a wafer transfer device and a transfer method. Background technique [0002] Semiconductor equipment for wafer processing usually includes atmospheric transport devices, wafer loading chambers, vacuum transfer devices, wafer processing chambers, etc. During the transfer process of the wafer, the wafer will be shifted, resulting in that the wafer entering the wafer processing chamber cannot be placed in the correct processing position, and wafer processing defects or even wafer scrapping will occur. [0003] In order to ensure that the entire transfer process of the wafer from the wafer storage box into the processing chamber, the position of the wafer is accurate, the usual practice is to ensure that the offset of the wafer during the transfer process is less than the design value through structural design, the method of this method The disadvantages are: the enti...

AI Technical Summary

Problems solved by technology

During the transfer process of the wafer, the wafer will be shifted, causing the wafer entering the wafer processing chamber to not be placed in the correct processing position, resulting in wafer processing defects or even wafer scrapping

[0003] In order to ensure that the entire transfer process of the wafer from the wafer storage box into the processing chamber, the position of the wafer is accurate, the usual practice is to ensure that the offset of the wafer during the transfer process is less than the design value through structural design, the method of this method The disadvantages are: the entire transmission path is long, and there are many transmission parts involved, and the design and processing requirements for each part are too high, which obviously increases the design and manufacturing costs of the equipment; During the process, the offset value of the wafer is detected and corrected before placement to ensure the position of the wafer. This method has lower requirements for the design and processing of the transmission parts, but its obvious disadvantage is: only during transmission The position of the wafer is detected, and the deviation caused by the sliding of the wafer during placement is ignored; usually in order to improve the production efficiency of semiconductor equipment, the moving speed of the robot arm is faster, and the faster moving speed will often cause the wafer to be in the Sliding relative to the supporting part during placement; therefore, the position of the wafer after placement must be checked to ensure the processing results of the wafer

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