Graphene cleaning and transferring method
A transfer method, graphene technology, applied in chemical instruments and methods, inorganic chemistry, non-metallic elements, etc., can solve problems such as surface impurity residue, reduce impurities, avoid solution immersion, and improve electrical performance.
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Embodiment 1
[0029] A kind of graphene clean transfer method that preferred embodiment of the present invention provides, comprises the following steps:
[0030] S1. Build tape / target substrate / graphene / metal structure: transfer graphene grown on metal copper foil (graphene / copper foil) to target substrate SiO 2 / Si as an example, such as figure 1 As shown, the clean target substrate was edge-sealed on a piece of graphene / copper slightly larger than the target substrate with thermal release tape to avoid the solution entering between the graphene and the target substrate during subsequent processing;
[0031] S2. Etching: press the tape / silicon wafer / graphene / copper foil structure figure 2 In the manner shown, metal copper is etched in 1mol / L ferric chloride mixed with 5% hydrochloric acid in the etching solution to form a graphene / silicon wafer / tape structure;
[0032] S3. Cleaning: After the etching is completed, remove the graphene / silicon wafer / tape structure from the etching soluti...
Embodiment 2
[0036] A kind of graphene clean transfer method that preferred embodiment of the present invention provides, comprises the following steps:
[0037] S1. Build tape / target substrate / graphene / metal structure: transfer graphene grown on metal copper foil (graphene / copper foil) to target substrate SiO 2 / Si as an example, such as figure 1 As shown, the clean target substrate is sealed on a piece of graphene / copper slightly larger than the target substrate with an insulating tape edge, so as to avoid the solution entering between the graphene and the target substrate during subsequent processing;
[0038] S2. Etching: press the tape / silicon wafer / graphene / copper foil structure figure 2 In the way shown, metal copper is etched in a 0.3mol / L ammonium persulfate solution to form a graphene / silicon wafer / tape structure;
[0039] S3. Cleaning: After the etching is completed, remove the graphene / silicon wafer / tape structure from the etching solution, and then rinse it in deionized wat...
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