Silicon wafer CMP post-processing equipment and processing flow

A silicon wafer and equipment technology, which is applied in the field of silicon wafer CMP post-processing equipment and processing flow, can solve the problems of high worker intensity, low productivity, and incomplete cleaning effect, and achieve high cleaning precision and high productivity.

Active Publication Date: 2019-06-07
若名芯半导体科技(苏州)有限公司
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the existing CMP production and processing of silicon wafers, either a single wafer of silicon wafers is transported by a robot, so that the production capacity is low and cannot meet the actual production and processing needs; or a box of silicon wafers is manually processed. Although the silicon wafers are always in ozone water at this time, which can ensure that the silicon wafers are in a wet state, the manual handling method leads to high labor intensity and cannot further improve production efficiency; at the same time, the cleaning of silicon wafers after CMP In the process, the cleaning effect is not thorough, and the particles, organic matter and SiO on the silicon wafer cannot be removed 2 removal, and thus cannot guarantee the high-precision requirements of silicon wafer production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon wafer CMP post-processing equipment and processing flow
  • Silicon wafer CMP post-processing equipment and processing flow

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] Embodiment one: a kind of cleaning process after silicon chip CMP, comprises the following steps:

[0068] (1) Pre-cleaning:

[0069] Step1: Carry out vibration cleaning to silicon chip by ozone water and ultrasonic cleaning equipment for 20 seconds;

[0070] Step2: first utilize the hydrofluoric acid of concentration 2% to rinse the silicon wafer for 10 seconds, then utilize ozone water to rinse the silicon wafer for 30 seconds;

[0071] Step3: Repeat the operation of Step2 three times, and alternately rinse the silicon wafer with hydrofluoric acid and ozone water several times;

[0072] Step4: Brush the front side of the silicon wafer with the alkaline liquid medicine, and the scrubbing time is 2 minutes;

[0073] Step5: Rinse the silicon wafer with pure water for 10 seconds, and finally spin the silicon wafer to dry.

[0074] (2) Inspection, use the inspection machine to inspect the pre-cleaned silicon wafers, if the pre-cleaned silicon wafers meet the requirement...

Embodiment 2

[0080] A cleaning process after silicon chip CMP comprises the steps:

[0081] (1) Pre-cleaning:

[0082] Step1: Carry out vibratory cleaning to silicon chip by ozone water and ultrasonic cleaning equipment for 80 seconds;

[0083] Step2: first utilize the hydrofluoric acid of concentration 4% to rinse the silicon wafer for 18 seconds, then utilize ozone water to rinse the silicon wafer for 36 seconds;

[0084] Step3: Repeat the operation of Step2 5 times, and alternately rinse the silicon wafer with hydrofluoric acid and ozone water several times;

[0085] Step4: Brush the front of the silicon wafer with the alkaline liquid medicine, and the scrubbing time is 4 minutes;

[0086] Step5: Rinse the silicon wafer with pure water for 50 seconds, and finally spin the silicon wafer to dry.

[0087] (2) Inspection, use the inspection machine to inspect the pre-cleaned silicon wafers, if the pre-cleaned silicon wafers meet the requirements, enter step three; if not meet the require...

Embodiment 3

[0092] Embodiment three: a kind of cleaning process after silicon chip CMP, comprises the following steps:

[0093] (1) Pre-cleaning:

[0094] Step1: Carry out vibratory cleaning to silicon chip by ozone water and ultrasonic cleaning equipment for 30 seconds;

[0095] Step2: first utilize the hydrofluoric acid of concentration 1.5% to rinse the silicon wafer for 10 seconds, and then utilize ozone water to rinse the silicon wafer for 33 seconds;

[0096] Step3: Repeat the operation of Step2 three times, and alternately rinse the silicon wafer with hydrofluoric acid and ozone water several times;

[0097] Step4: Brush the front side of the silicon wafer with the alkaline liquid medicine, and the scrubbing time is 1.5 minutes;

[0098] Step5: Rinse the silicon wafer with pure water for 12 seconds, and finally spin and dry the silicon wafer.

[0099] (2) Inspection, use the inspection machine to inspect the pre-cleaned silicon wafers, if the pre-cleaned silicon wafers meet the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to silicon wafer CMP post-processing equipment and a processing flow. The silicon wafer CMP post-processing equipment comprises an ozone water tank and a pure water flushing tank, wherein the ozone water tank and the pure water flushing tank are located at the rear ends of a plurality of CMP processing devices; a mechanical arm; a CMP post-cleaning device, wherein a water tank for placing a silicon wafer storage box is arranged at the front end of the CMP post-cleaning device. The processing method comprises the following steps: 1, processing silicon wafers by the CMP processing devices, and putting the silicon wafers into the silicon wafer storage box located in the ozone water tank of the CMP processing devices; 2, putting the silicon wafer storage box at the firststep in the pure water flushing tank for flushing; 3, delivering the silicon wafer storage box in the pure water flushing tank at the rear ends of the CMP processing devices to the water tank at the front end of the CMP post-cleaning device through the mechanical arm; 4, cleaning the silicon wafers in the silicon wafer storage box in the water tank one by one by the CMP post-cleaning device by using a CMP post-cleaning process. The method has the following advantages: (1) the silicon wafers are in a wet state in the whole process, and the cleaning precision of the silicon wafers is high; (2) the cleaning process effect of the silicon wafers after CMP is good.

Description

technical field [0001] The invention belongs to the related field of silicon wafer production and processing, and in particular relates to a silicon wafer CMP post-processing equipment and a processing flow. Background technique [0002] In the existing semiconductor manufacturing process, in order to better meet the high requirements of photolithography for planarization, chemical mechanical polishing process, that is, CMP has been widely used in deep submicron technology (<0.25um). [0003] In the CMP production and processing of silicon wafers, it is first necessary to perform CMP processing on the silicon wafers, and then to perform subsequent cleaning and processing on the silicon wafers, so as to ensure the high precision requirements of the silicon wafers. [0004] However, in the existing CMP production and processing of silicon wafers, either a single wafer of silicon wafers is transported by a robot, so that the production capacity is low and cannot meet the act...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67B08B3/02B08B3/08B08B3/10B08B13/00
Inventor 余涛唐杰
Owner 若名芯半导体科技(苏州)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap