Silicon crystal orientation discriminator

Abstract

The invention discloses a silicon crystal orientation discriminator. The discriminator comprises a laser emitter, a lens, a detection unit, a beam splitting unit, a light intensity detector and a polarization detector arranged sequentially along the beam direction. The laser emitted by the laser emitter After being focused by the lens, it is irradiated to the detection unit. The detection unit forms reflected light and outputs it to the beam splitting unit. The beam splitting unit outputs two beams and is respectively received by the light intensity detector and the polarization detector. The light intensity of the reflected laser light and the displacement of the light spot, the polarization detector measures the polarization of the reflected laser light and the displacement of the light spot after passing through the inspection unit. This discriminator effectively improves the accuracy of silicon crystal direction identification, thereby improving the alignment accuracy of the mask plate and the large crystal direction of the wafer, and the structure of the optical path components is simple, reducing equipment costs, and has the advantages of fast response, high precision, and high reliability. .

Description

technical field [0001] The invention relates to the field of optical technology, in particular to a silicon crystal orientation discriminator. Background technique [0002] At present, the traditional methods for identifying the crystal orientation of silicon are mostly X-ray diffraction crystal orientation calibration technology and laser reflection calibration method, but the required equipment is expensive and the accuracy is not high. In the processing of micro-devices, the anisotropic etching characteristics of single crystal silicon materials are used to form structures of various shapes by wet chemical processes. In this processing technology, the alignment accuracy of the pattern on the mask plate and the large crystal direction of the wafer has a great influence on the manufacturing accuracy of the unprocessed micro-devices. Therefore, it is the key technology of this processing technology to make the direction of the mask plate accurately locate to the specified c...

AI Technical Summary

Problems solved by technology

However, in the actual production of micro-devices, the positioning accuracy of the notch of the wafer is limited, which cannot meet the processing requirements of micro-devices, and in the process of micro-devices, due to the existence of this alignment error low quality

Especially for those micro devices with slender rod structure, the error is larger

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