Aluminum-silicon alloy lamellar gradient material and preparing, processing and applying thereof

Abstract

The invention relates to a preparation method of an aluminum-silicon alloy lamellar gradient material. The preparation method comprises the following steps that 1, the layer number, the layer composition and the layer thickness of the aluminum-silicon alloy lamellar gradient material are designed, and raw materials with different silicon contents are prepared from, by weight, 22%-70% of silicon and the balance aluminum; 2, the raw materials which are prepared in the step 1 and have the different silicon contents are smelted; 3, aluminum-silicon alloy layers are prepared from aluminum-silicon alloy melt which is obtained in the step 2 and has the different silicon contents by adopting a rapid solidification and spraying deposition technology layer by layer; and 4, densification treatment isconducted on an ingot blank obtained in the step 3 by adopting pressure sintering, and the aluminum-silicon alloy lamellar gradient material is obtained. According to the preparation method, the gradient structure of the material can be designed according to the application requirements, and the preparation method has the advantages that the controllability is good, the process is stable, and theprepared gradient material is compact in structure and tight in bonding of layers. The gradient material is high in designability and suitable for electronic packaging shells.

Description

technical field [0001] The invention relates to the technical field of gradient functional materials, in particular to an aluminum-silicon alloy layered gradient material and its preparation and application. Background technique [0002] There are many types of electronic packaging materials. Traditional metal-based and ceramic electronic packaging materials mainly include Cu, Al, Ti, Kovar, W / Cu, Mo / Cu, Al / SiC, Al 2 o 3 , AlN, etc. With the development of modern electronic systems in the direction of miniaturization, light weight, high operating frequency, high power density, multi-function and high reliability, traditional electronic packaging materials are no longer competent in terms of thermal expansion coefficient matching, light weight and hermetic welding. . [0003] However, the existing homogeneous aluminum-based composite materials and aluminum-silicon alloy electronic packaging materials are still difficult to meet the requirements of thermal expansion matchin...

AI Technical Summary

Problems solved by technology

With the development of modern electronic systems in the direction of miniaturization, light weight, high operating frequency, high power density, multi-function and high reliability, traditional electronic packaging materials are no longer competent in terms of thermal expansion coefficient matching, light weight and hermetic welding.

[0003] However, the existing homogeneous aluminum-based composite materials and aluminum-silicon alloy electronic packaging materials are still difficult to meet the requirements of thermal expansion matching, high thermal conductivity, machining, welding, etc., for example, the mechanical properties of low-silicon-content aluminum-silicon alloys Low, especially the elastic modulus is small; and when the silicon content exceeds 50%, the mechanical properties and welding properties are not ideal

Images