A framing camera photocathode based on inorganic perovskite and its preparation method
A framing camera, photocathode technology, applied in the manufacture of light-emitting cathodes, secondary and light-emitting cathodes, main electrodes of discharge tubes, etc., to achieve excellent detection efficiency, simple steps, and good stability.
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[0032] Such as figure 2 Shown, the preparation method of the framing camera photocathode based on inorganic perovskite of the present invention comprises the following steps:
[0033] 1. Provide a piece of MCP1, use alcohol to ultrasonically clean the MCP1 and then dry it;
[0034] 2. Cover the upper surface of MCP1 with a mask, and use the coating method of magnetron sputtering or atomic layer deposition to plate metal microstrip 2 on the upper surface of MCP1;
[0035] 3. Configure CsPbI 3 Precursor solution;
[0036] 4. Put the MCP1 obtained in step b into CsPbI 3 Precursor solution is heated until a layer of CsPbI is formed on the upper surface of the metal microstrip 2 and the inner wall of the microchannel of MCP1 3 film3;
[0037] 5. Convert the MCP1 obtained in step d from CsPbI 3 Take it out from the precursor solution, put it into an oven to heat and dry;
[0038] 6. Using the coating method of magnetron sputtering or atomic layer deposition, the lower surfac...
Embodiment 1
[0044]The CsPbI of the framing camera photocathode based on the inorganic perovskite of the present embodiment 3 Thin film 3 has a thickness of 50 nm.
[0045] The preparation process of the framing camera photocathode based on inorganic perovskite in this embodiment is as follows:
[0046] 1. Provide a piece of MCP1, use alcohol to ultrasonically clean the MCP1 and then dry it; the aperture of the microchannel is 3 μm, the thickness of the MCP1 is 100 μm, and the radial direction of the microchannel deviates from the surface normal of the MCP1 by 3°;
[0047] 2. Cover the upper surface of MCP1 with a mask, and use the coating method of magnetron sputtering or atomic layer deposition to plate metal microstrips 2 on the upper surface of MCP1; the number of metal microstrips 2 is 1, and the number of metal microstrips 2 The thickness of the copper layer is 500nm;
[0048] 3. Configure CsPbI 3 Precursor solution; its polar organic solvent is DMF;
[0049] 4. Put the MCP1 obta...
Embodiment 2
[0053] The CsPbI of the framing camera photocathode based on the inorganic perovskite of the present embodiment 3 Thin film 3 has a thickness of 150 nm.
[0054] The preparation process of the framing camera photocathode based on inorganic perovskite in this embodiment is as follows:
[0055] 1. Provide a piece of MCP1, use alcohol to ultrasonically clean the MCP1 and then dry it; the aperture of the microchannel is 5 μm, the thickness of the MCP1 is 500 μm, and the radial direction of the microchannel deviates from the surface normal of the MCP1 by 4°;
[0056] 2. Cover the upper surface of MCP1 with a mask, and use the coating method of magnetron sputtering or atomic layer deposition to plate metal microstrips 2 on the upper surface of MCP1; the number of metal microstrips 2 is 4, and the number of metal microstrips 2 The thickness of the copper layer is 1000nm;
[0057] 3. Configure CsPbI 3 Precursor solution; its polar organic solvent is GBL;
[0058] 4. Put the MCP1 o...
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