High temperature resistant water-cooled DC support capacitor

A DC support capacitor, high temperature resistance technology, applied in the direction of multilayer capacitors, multiple fixed capacitors, parts of fixed capacitors, etc., can solve the problem that the heat of the capacitor core is not easy to dissipate, and achieve a wide range of applications.

Pending Publication Date: 2019-05-17
扬州日精电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a high-temperature-resistant water-cooled DC support capacitor, which is used to solve the problem that the heat generated between the capacitor cores is not easy to dissipate, and can not only extend the life of the capacitor core It can also prevent the risk of thermal breakdown of the capacitor core due to heat

Method used

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  • High temperature resistant water-cooled DC support capacitor
  • High temperature resistant water-cooled DC support capacitor
  • High temperature resistant water-cooled DC support capacitor

Examples

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Embodiment 1

[0032] Such as figure 1 As shown, this illustration is a front view of the present invention, wherein the first heat sink 21 is L-shaped, and six heat dissipation components 2 are placed and four layers of capacitor core groups 1 are placed in each heat dissipation component 2 schematic diagram.

[0033] The high temperature resistant water-cooled DC support capacitor provided by the present invention includes a heat dissipation aluminum plate 3, six heat dissipation components 2 and twenty-four sets of capacitor core groups 1, the six heat dissipation components 2 are arranged side by side on the heat dissipation aluminum plate 3, and the heat dissipation components 2 includes a first heat sink 21. In this embodiment, the first heat sink 21 is L-shaped. Four sets of capacitor core groups 1 are vertically stacked on the first heat sink 21, and each vertically stacked capacitor core group 1 A second cooling fin 22 is arranged between two adjacent groups, one first cooling fin ...

Embodiment 2

[0037] Such as image 3 As shown, this illustration is a front view of the present invention, wherein the first heat sink 21 is U-shaped, and five heat dissipation components 2 are placed and four layers of capacitor core groups 1 are placed in each heat dissipation component 2 schematic diagram.

[0038] The high temperature resistant water-cooled DC support capacitor provided by the present invention includes a heat dissipation aluminum plate 3, five heat dissipation components 2 and twenty sets of capacitor core groups 1, and the five heat dissipation components 2 are arranged side by side on the heat dissipation aluminum plate 3, and the heat dissipation components 2 Including the first heat sink 21, the first heat sink 21 in this embodiment is U-shaped, four groups of capacitor core groups 1 are vertically stacked on the first heat sink 21, and each phase of the vertically stacked capacitor core groups 1 A second cooling fin 22 is arranged between two adjacent groups. On...

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Abstract

The invention belongs to the technical field of film capacitor structures, and in particular relates to a high temperature resistant water-cooled DC support capacitor comprising a heat dissipating aluminum plate, a plurality of heat dissipating components and a plurality of capacitor core groups, wherein the plurality of heat dissipating components are arranged side by side on the heat dissipatingaluminum plate, the heat dissipating components comprise a first heat sink, the plurality of capacitor core groups are vertically stacked on the first heat sink, second heat sinks are disposed between each adjacent two groups of the vertically stacked capacitor core groups, and the first heat sink is integrally formed with the plurality of the second heat sinks. The high temperature resistant water-cooled DC support capacitor has the beneficial effects that the heat of the center of the capacitor cores is transferred to the thin copper piece through the surfaces of the cores and then transferred to the heat dissipating aluminum plate for further heat dissipation by using a thin copper piece with a thickness of 0.5mm in the middle of the superposition of the multiple layers of the capacitor core groups through a unique heat dissipation structure; at the same time, the heat dissipating components can stack the multiple layers of the capacitor core groups, which makes the practical application field more extensive.

Description

technical field [0001] The invention belongs to the technical field of film capacitor structures, and in particular relates to a high temperature resistant water-cooled DC support capacitor. Background technique [0002] Metallized film capacitors are one of the basic components of electronic equipment. They can be used in the fields of DC blocking, bypass, coupling, filtering, energy conversion, tuning loops and control circuits. Due to the increasing use of new energy electric drive electronic control systems The SiC IGBT has higher and higher requirements on the ambient temperature, which can reach up to 125°C. In addition, the capacitor itself will heat itself when passing the ripple current. The superimposed temperature will cause thermal runaway or even thermal breakdown of the PP film capacitor. The core in the DC support capacitor is often composed of multiple cores connected in parallel. Since the PP material is anisotropic, the thermal conductivity between layers i...

Claims

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Application Information

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IPC IPC(8): H01G4/33H01G4/38H01G4/002
Inventor 张淮鑫郑永豪朱国荣陈重生夏顶锁
Owner 扬州日精电子有限公司
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