High temperature resistant water-cooled DC support capacitor
A DC support capacitor, high temperature resistance technology, applied in the direction of multilayer capacitors, multiple fixed capacitors, parts of fixed capacitors, etc., can solve the problem that the heat of the capacitor core is not easy to dissipate, and achieve a wide range of applications.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0032] Such as figure 1 As shown, this illustration is a front view of the present invention, wherein the first heat sink 21 is L-shaped, and six heat dissipation components 2 are placed and four layers of capacitor core groups 1 are placed in each heat dissipation component 2 schematic diagram.
[0033] The high temperature resistant water-cooled DC support capacitor provided by the present invention includes a heat dissipation aluminum plate 3, six heat dissipation components 2 and twenty-four sets of capacitor core groups 1, the six heat dissipation components 2 are arranged side by side on the heat dissipation aluminum plate 3, and the heat dissipation components 2 includes a first heat sink 21. In this embodiment, the first heat sink 21 is L-shaped. Four sets of capacitor core groups 1 are vertically stacked on the first heat sink 21, and each vertically stacked capacitor core group 1 A second cooling fin 22 is arranged between two adjacent groups, one first cooling fin ...
Embodiment 2
[0037] Such as image 3 As shown, this illustration is a front view of the present invention, wherein the first heat sink 21 is U-shaped, and five heat dissipation components 2 are placed and four layers of capacitor core groups 1 are placed in each heat dissipation component 2 schematic diagram.
[0038] The high temperature resistant water-cooled DC support capacitor provided by the present invention includes a heat dissipation aluminum plate 3, five heat dissipation components 2 and twenty sets of capacitor core groups 1, and the five heat dissipation components 2 are arranged side by side on the heat dissipation aluminum plate 3, and the heat dissipation components 2 Including the first heat sink 21, the first heat sink 21 in this embodiment is U-shaped, four groups of capacitor core groups 1 are vertically stacked on the first heat sink 21, and each phase of the vertically stacked capacitor core groups 1 A second cooling fin 22 is arranged between two adjacent groups. On...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com