Encapsulating material, organic barrier cured product and quantum dot device
A technology for quantum dot devices and packaging materials, applied in the field of quantum dots, can solve the problems of poor glue hardness and barrier properties, difficult to meet the requirements of barrier properties, and inability to meet the requirements of anti-yellowing, and achieve excellent water and oxygen barrier properties. The effect of excellent yellowing properties, good hardness and barrier properties
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0054] The packaging material includes the following components by weight:
[0055]
[0056]
[0057] Among them, the cyclic silicone modified epoxy resin is:
[0058]
[0059] where R1 is The value of m is 1.
Embodiment 2
[0061] The packaging material includes the following components by weight:
[0062]
[0063] Among them, the cyclic silicone modified epoxy resin is:
[0064]
[0065] where R1 is The value of m is 3.
Embodiment 3
[0067] The packaging material includes the following components by weight:
[0068]
[0069] Among them, the cyclic silicone modified epoxy resin is:
[0070]
[0071] where R1 is The value of m is 0.
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com