Lead frame and production process thereof

Abstract

The invention discloses a lead frame and a production process thereof. The lead frame comprises a support matrix, wherein the support matrix comprises two side horizontal edge straps and a plurality of LED single racks, the plurality of LED single racks are transversely and longitudinally arranged between the two side horizontal edge straps in an array way, a longitudinal connection belt longitudinally arranged and a transverse connection belt transversely arranged are arranged between adjacent LED single racks, a rectangular hollow region is arranged between arbitrary adjacent LED single racks and is arranged on the longitudinal connection belt, a positioning through hole is formed in a cross part of the longitudinal connection belt and the horizontal connection belt, and a cutting positioning hole is formed in the arbitrary horizontal edge belt. In the production process, the etching step is optimized and controlled. The lead frame is ingenious in design, the cutting demand of the arbitrary LED single rack is satisfied, the deformation quantity of the LED single rack after cutting is small, and high-accuracy demand is satisfied; drying is performed after surface cleaning, the LEDsignal rack employs ingenious design of an H-shaped isolation groove, wrapping, package and base separation are easy; and the process flow is fine, etching is efficient, the formation accuracy is high, and the process is suitable for promotion and application.

Description

technical field [0001] The invention relates to a lead frame and a production process thereof, and belongs to the technical field of EMC brackets and the production process thereof. Background technique [0002] EMC is an important microelectronic packaging material. Through the packaging process, the semiconductor chip is covered to form a protection, so as not to be damaged by the external environment; at the same time, EMC also has a certain heat dissipation effect. EMC has the characteristics of large-scale production and reasonable reliability, and is one of the common packaging materials for semiconductor packaging. [0003] EMC has excellent properties such as high reliability, high thermal conductivity, high heat and humidity resistance, low stress, and low expansion coefficient, and is very suitable for LED packaging devices. LED lead frame is a highly integrated bracket, known as the third generation LED bracket; Compared with the first generation PPA pre-molded f...

AI Technical Summary

Problems solved by technology

[0004] In order to facilitate the free cutting of the lead frame in the later stage, there are generally several LED monomer frames in the horizontal and vertical directions, and the LED monomer frames are connected by horizontal and vertical connecting strips. The horizontal and vertical connecting strips are relatively hard and distributed in a strip shape overall. When the single frame is cut, it is easy to cause bending damage to the LED single frame, and the pins on the LED single frame are isolated as double grooves, which is not conducive to the integrity of the LED single frame

[0005] In addition, the lead frame is becoming more and more refined, and the traditional etching process cannot meet the production of high-precision lead frames, and there are defects of low product qualification rate and low production efficiency

Images