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Polyimide precursor, precursor composition, polyimide, high temperature resistant transparent polyimide film and preparation method thereof

A technology of transparent polyimide and high temperature resistance, applied in the field of polymer material synthesis, can solve the problems of reduced mechanical properties and reduced heat resistance of high transparent polyimide, and achieves improved regularity, good light transmittance, The effect of improving the degree of plane orientation

Active Publication Date: 2021-08-17
株洲时代华昇新材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention overcomes the deficiencies and defects mentioned in the above background technology, provides a polyimide precursor, a precursor composition, a high-temperature-resistant transparent polyimide film and a preparation method thereof, and mainly solves the problem of high-transparency polyimide Problems of decreased heat resistance and decreased mechanical properties

Method used

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  • Polyimide precursor, precursor composition, polyimide, high temperature resistant transparent polyimide film and preparation method thereof
  • Polyimide precursor, precursor composition, polyimide, high temperature resistant transparent polyimide film and preparation method thereof
  • Polyimide precursor, precursor composition, polyimide, high temperature resistant transparent polyimide film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0056] A high-temperature-resistant transparent polyimide film, which is produced by thermal imidization method, and is obtained by casting a polyamic acid precursor composition and temperature-programmed treatment;

[0057] Wherein, the polyamic acid precursor accounts for the mass content of composition and is 10wt%;

[0058] The diamine monomer used is 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, and the main dianhydride monomer is 4 , 4-(hexafluoroisopropylene) diphthalic anhydride, the dianhydride monomer is 4,4'-oxydiphthalic anhydride;

[0059] The main dianhydride monomer accounts for 70% of the total molar amount of dianhydride, and the controlled dianhydride monomer accounts for 30% of the total molar amount of dianhydride;

[0060] The temperature programming sequence is: room temperature—100°C (10min)—180°C (10min)—260°C (10min)—320°C (10min).

Embodiment 2

[0062] A high-temperature-resistant transparent polyimide film, which is produced by chemical imidization method, is obtained by mixing polyamic acid precursor composition and accelerator, casting and temperature-programmed treatment;

[0063] Wherein, the polyamic acid precursor accounts for the mass content of composition and is 10wt%;

[0064] The diamine monomer used is 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, and the main dianhydride monomer is 4 , 4-(hexafluoroisopropylene) diphthalic anhydride, the dianhydride monomer is 4,4'-oxydiphthalic anhydride;

[0065] The main dianhydride monomer accounts for 70% of the total molar amount of dianhydride, and the controlled dianhydride monomer accounts for 30% of the total molar amount of dianhydride;

[0066] The accelerator is composed of pyridine and acetic anhydride in a mass ratio of 1:1, the mass ratio of the sum of the catalyst and dehydrating agent to the solvent is 3:7; the mass ratio of the prec...

Embodiment 3

[0069] A high-temperature-resistant transparent polyimide film, which is produced by chemical imidization method, is obtained by mixing polyamic acid precursor composition and accelerator, casting and temperature-programmed treatment;

[0070] Wherein, the polyamic acid precursor accounts for the mass content of composition and is 10wt%;

[0071] The diamine monomer used is 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, and the main dianhydride monomer is 4 , 4-(hexafluoroisopropylene) diphthalic anhydride, the dianhydride monomer is 4,4'-oxydiphthalic anhydride;

[0072] The main dianhydride monomer accounts for 70% of the total molar amount of dianhydride, and the controlled dianhydride monomer accounts for 30% of the total molar amount of dianhydride;

[0073] The accelerator is composed of pyridine and acetic anhydride in a mass ratio of 1:1; the mass ratio of the sum of the catalyst and dehydrating agent to the solvent is 3:6; the mass ratio of the prec...

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Abstract

The invention discloses a polyimide precursor, a precursor composition, a polyimide, a high-temperature-resistant transparent polyimide film and a preparation method thereof. The polyimide precursor has the following general formula Polyamic acid: wherein, A is a structural unit derived from diamine, B 1 is a structural unit derived from the main dianhydride; B 2 It is a structural unit derived from regulating dianhydride, and the regulating dianhydride is one or more of the following structures: a high-temperature-resistant transparent polyimide film is formed from a precursor composition by thermal imidization or The film is obtained by chemical imidization method. The high heat-resistant colorless and transparent polyimide of the present invention has a light transmittance of more than 88%, such as 88-90%, and a glass transition temperature of more than 336°C, such as 336-360°C, and further 350-360°C. The coefficient of expansion is 15-21ppm / K, the tensile strength is 109-120MPa, and the elongation at break is 20-26%.

Description

technical field [0001] The invention belongs to the field of polymer material synthesis, and in particular relates to a polyimide precursor, a precursor composition, a high-temperature-resistant transparent polyimide film and a preparation method thereof. Background technique [0002] With the development of science and technology, the display field is gradually developing in the direction of large-scale, thin and flexible. The use of flexible transparent polymers to replace traditional hard glass in display devices is a key technology to achieve flexible displays. Polyimide has outstanding heat resistance and can withstand high-temperature processes such as electrode film deposition and annealing during the display process, and has attracted widespread attention in the industry. [0003] Due to the strong intermolecular and intramolecular interactions in the molecular structure of traditional aromatic polyimides, it is easy to form a charge transfer complex between the ele...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18
Inventor 江乾刘亦武王倩段瑨王进姜其斌
Owner 株洲时代华昇新材料技术有限公司
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