High-efficiency micro-conduction heat dissipation module

Abstract

The invention relates to a high-efficiency micro-conduction heat dissipation module. The heat dissipation module includes a module upper cabinet body, a module lower cabinet body and high-efficiency micro-conduction heat dissipation bodies; the multiple high-efficiency micro-conduction heat dissipation bodies are fixed in the module upper cabinet body and the module lower cabinet body; the high-efficiency micro-conduction heat dissipation bodies are integral structures and include matrixes, microchannel heat conduction cavities and heat dissipation fins; the upper parts of the matrixes are heat dissipation sections, the lower parts of the matrixes are heat absorption sections, and flanges are installed at the middle parts of the matrixes; the heat dissipation sections are provided with themultiple heat dissipation fins; the matrixes are provided with the microchannel heat conduction cavities; the microchannel heat conduction cavities consist of multiple independent microchannels whichare not connected to each other; the outer planes of the heat absorption sections of the matrixes are heat absorbent surfaces; the heat dissipation sections of the matrixes are fixed in the module upper cabinet body, and the heat absorption sections of the matrixes are fixed in the module lower cabinet body; and intelligent power modules are fixed on the heat absorbent surfaces of the matrixes. The advantages of the heat dissipation module are as follows: the heat dissipation module has advantages of being compact in structure, small in size and light in weight; the space and weight requirements of ship equipment can be met; and requirements of conducting heat from an enclosed cavity to external space to perform heat dissipation can be realized.

Description

technical field [0001] The invention relates to a high-efficiency micro-conduction heat dissipation module, in particular to a heat dissipation module suitable for the field of heat transfer and heat dissipation in a water surface and underwater ship control power supply in a sealed and protected airtight cavity. Background technique [0002] Ocean-going ships are the main body of material transportation, and large tonnage, high speed, and highly integrated intelligent control have become the development direction of ocean-going ships. A highly integrated intelligent control system requires the characteristics of large capacity, small size, light weight, and high degree of automation. The core device, the new generation of intelligent power modules, has higher computing speed and response efficiency than the technical indicators of existing power modules. At the same time, the power dissipation of the new generation of intelligent power modules is much larger than that of th...

AI Technical Summary

Problems solved by technology

However, the development of manufacturing technology and control technology of ocean-going ships has prompted the highly integrated intelligent control system to adopt a new generation of intelligent power modules to meet its performance indicators, and the high integration of the new generation of intelligent power modules results in very high heat during work. Large, the current profile air-cooled heat dissipation, water-cooled heat dissipation and heat pipe heat dissipation products with conventional structures cannot meet the use requirements of heat dissipation

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