High-precision, high-reliability multi-layer low-resistance thermal chip and method for making the same

Abstract

The invention relates to a high-precision, high-reliability, multi-layer, low-resistance thermosensitive chip, which includes a ceramic body, a surface electrode arranged on the top surface of the ceramic body, a bottom electrode arranged on the bottom surface of the ceramic body, and N electrodes arranged inside the ceramic body An electrode layer, N is an even number greater than or equal to 2; the ceramic body is composed of N+1 ceramic layers stacked, and an electrode layer is arranged between every two adjacent ceramic layers, and one side of the ceramic body is opened There are first holes penetrating through No. 1 to No. N ceramic layers, and second holes penetrating No. 2 to No. N+1 ceramic layers are opened on the other side, the first holes are filled with first hole electrodes, and the second holes are The second holes are filled with second hole electrodes. The invention also relates to a manufacturing method of the high-precision, high-reliability, multi-layer, low-resistance thermal chip. The high-precision, high-reliability, multi-layer, low-resistance heat-sensitive chip of the invention can realize small size, low resistance value and high B value at the same time.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a high-precision, high-reliability, multi-layer, low-resistance thermal chip and a manufacturing method thereof. Background technique [0002] Such as figure 1 As shown, the traditional thermistor chip has a three-layer structure, including a porcelain body 1' and metal electrodes 2' respectively arranged on both surfaces of the porcelain body 1', and the metal electrodes 2' are usually silver electrodes. Such as figure 2 As shown, the preparation process of the traditional thermistor chip is: ceramic powder preparation → sintering ceramic ingots → slicing → printing metal electrodes → sintering metal electrodes. [0003] Thermistor chip products with traditional three-layer structure often cannot achieve the purpose of low resistance and high B value under the condition of controlling the chip size due to the inherent resistivity and B value of the ceramic mater...

AI Technical Summary

Problems solved by technology

[0003] Thermistor chip products with traditional three-layer structure often cannot achieve the purpose of low resistance and high B value under the condition of controlling the chip size due to the inherent resistivity and B value of the ceramic material itself, and often low resistance Products with a high B value will have a very large chip size, which cannot be used in some microcircuits and miniaturized production. At the same time, the excessively large chip size brings the disadvantage of slow response speed, resulting in a decrease in product measurement sensitivity.

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