Heat dissipation optimization method for brick power supply

Abstract

The invention discloses a heat dissipation optimization method and apparatus for a brick power supply. The method comprises the steps that a device with a potential triggering shadow effect in wave soldering is far away from the brick power supply on a printed circuit board; the aperture of each inserting pin hole of the brick power supply on the printed circuit board is expanded; the copper laying area around each inserting pin hole of the brick power supply on the printed circuit board is reduced; a heat collecting hole and / or a hole exposing ring is formed in / on each inserting pin hole of the brick power supply on the printed circuit board; and tin is sprayed on the surface of the printed circuit board. According to the technical scheme, different pins or different pin holes of the brick power supply and the printed circuit board can be subjected to targeted welding optimization, so that the tin applying rate of the pins and the pin holes is improved, the tin penetrating effect of wave soldering is improved, the strength of welding spots is improved, and the working stability of the brick power supply is improved.

Description

technical field [0001] The present invention relates to the field of power supplies, and more specifically, relates to a method for optimizing heat dissipation of a brick power supply. Background technique [0002] With the development of applications such as high-performance computing and GPU, the power consumption of servers continues to increase, and the 48V power supply scheme for boards is put into use. As the server power design requirements are increasing, the component density is getting higher and higher, and the demand for miniaturization is increasing, so the application of 48V brick power supply is increasing. A brick power supply refers to a modular power supply that looks like a brick and is sealed and filled with glue. In the prior art, the package size of a full brick power supply is 116.8×61×12.7mm, and the package size of a half brick power supply (1 / 2 brick) is 61×57.9× The 12.7mm, 1 / 4 brick power package size is 57.9×36.8×12.7mm. The application of smal...

AI Technical Summary

Problems solved by technology

On the one hand, the pins of the brick power plug-in have more soldering layers on the PCB board, and on the other hand, due to the thicker pin diameter, the heat dissipation is relatively fast, and there are poor tinning and de-tinning on the pins, non-wetting of the soldering, and insufficient filling. many other issues

In addition, the PCB board design and welding process are not optimized for this problem, resulting in unsatisfactory welding effect of the brick power supply

[0004] Aiming at the problem of poor welding effect caused by poor welding of brick power supply in the prior art, there is no effective solution at present

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