Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-end PCB metallization groove processing method

A technology of metallization grooves and processing methods, applied in electrical components, printed circuit manufacturing, printed circuits and other directions, can solve problems such as affecting function and appearance, promoting conductive function, metal ring removal, etc. boosted effect

Inactive Publication Date: 2019-04-09
惠州市大亚湾科翔科技电路板有限公司
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the existing technology, there are mainly the following problems: the copper skin on the side of the special-shaped hole is lifted during forming, which affects the function and appearance; the metal of the special-shaped hole is circled during forming, which promotes the conductive function

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-end PCB metallization groove processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A high-end PCB metallization groove processing method is characterized in that it includes the following steps: material cutting → drilling 1 → sinking copper → board electrical → outer circuit → drawing electrical → drilling 2 → etching → solder mask → text → chemical Gold→Forming→FQC→FQA→Packaging.

[0018] Further, the diameter of the drill tip used in the second drilling hole is consistent with that of the forming milling cutter.

[0019] Further, in the second drilling process, the diameters of the drill bit and the forming milling cutter used are both 2.2 mm.

[0020] Further, during the second drilling process, the drilling position is to drill a hole 2 at both ends of the special-shaped hole 1 .

[0021] Furthermore, after the second drilling process, the copper skin ridges produced when the drill bit cuts the metal hole wall are etched to clean the excess ridges.

[0022] Further, during the forming process, the milling cutter does not directly contact the me...

Embodiment 2

[0026] A high-end PCB metallization groove processing method is characterized in that it includes the following steps: material cutting → drilling 1 → sinking copper → board electrical → outer circuit → drawing electrical → drilling 2 → etching → solder mask → text → chemical Gold→Forming→FQC→FQA→Packaging.

[0027] Further, the diameter of the drill tip used in the second drilling hole is consistent with that of the forming milling cutter.

[0028] Further, in the second drilling process, the diameters of the drill bit and the forming milling cutter used are both 1.4 mm.

[0029] Further, during the second drilling process, the drilling position is to drill a hole at both ends of the special-shaped hole.

[0030] Furthermore, after the second drilling process, the copper skin ridges produced when the drill bit cuts the metal hole wall are etched to clean the excess ridges.

[0031] Further, during the forming process, the milling cutter does not directly contact the metal o...

Embodiment 3

[0035] A high-end PCB metallization groove processing method is characterized in that it includes the following steps: material cutting → drilling 1 → sinking copper → board electrical → outer circuit → drawing electrical → drilling 2 → etching → solder mask → text → chemical Gold→Forming→FQC→FQA→Packaging.

[0036] Further, the diameter of the drill tip used in the second drilling hole is consistent with that of the forming milling cutter.

[0037] Further, in the second drilling process, the diameters of the drill bit and the forming milling cutter used are both 1.6 mm.

[0038] Further, during the second drilling process, the drilling position is to drill a hole at both ends of the special-shaped hole.

[0039] Furthermore, after the second drilling process, the copper skin ridges produced when the drill bit cuts the metal hole wall are etched to clean the excess ridges.

[0040] Further, during the forming process, the milling cutter does not directly contact the metal o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a high-end PCB metallization groove processing method. The high-end PCB metallization groove processing method is characterized by comprising the following steps of cutting material, drilling a hole one, sinking copper, board electricity, outer layer line, drawing electricity, drilling a hole two, etching, welding resistance, text, metallization, forming, FQC, FQA and packaging successively. The high-end PCB metallization groove processing method can effectively avoid the forming milling cutter from directly contacting with the metal wall of the special-shaped hole whenprocessing, thereby improving the defects of special-shaped hole burrs and the copper rolling; therefore, the product yield is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of PCB, and in particular relates to a method for processing a high-end PCB metallization groove. Background technique [0002] PCB is an indispensable and important part of electronic products. With the continuous development of electronic products, the technical requirements for PCB are constantly updated, and the process of PCB is becoming more and more difficult and the process is becoming more and more complicated. [0003] The position of the special-shaped hole is on the edge of the board. The part of the special-shaped hole in the unit needs to be plated with copper and gold, and the other part needs to be cut off. Conventional process flow: material cutting → drilling → immersion copper → plate electrical → outer circuit → graphic electrical → etching → solder mask → text → chemical gold → forming → FQC → FQA → packaging. [0004] In the prior art, there are mainly the following problems: the cop...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00
CPCH05K3/0047
Inventor 郑晓蓉曾祥福周刚
Owner 惠州市大亚湾科翔科技电路板有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com